Patents by Inventor Dirk Dittmann

Dirk Dittmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12046576
    Abstract: A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: July 23, 2024
    Assignee: DANFOSS SILICON POWER GMBH
    Inventors: Martin Becker, Dirk Dittmann
  • Patent number: 11690734
    Abstract: Implant inserters and related methods are disclosed herein, e.g., for delivering a fusion cage or other implant to a spinal disc space and for rotating or articulating the implant within the disc space. An exemplary instrument can include an inner member having opposed jaws for grasping the implant and holding the implant during insertion. The inner member can be slidably received within an outer member such that relative axial translation of the inner and outer members is effective to open or close the jaws. The jaws and/or the distal end of the outer member can have a low-profile geometry, which can advantageously facilitate certain surgical procedures. For example, the low-profile geometry can allow for a more medial approach to an intervertebral disc space in which the implant is to be inserted.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: July 4, 2023
    Assignee: DEPUY SYNTHES PRODUCTS, INC.
    Inventors: Dirk Dittmann, William Miller, Jeff Walker
  • Publication number: 20220157773
    Abstract: A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.
    Type: Application
    Filed: February 27, 2020
    Publication date: May 19, 2022
    Inventors: Martin Becker, Dirk Dittmann
  • Publication number: 20210275324
    Abstract: Implant inserters and related methods are disclosed herein, e.g., for delivering a fusion cage or other implant to a spinal disc space and for rotating or articulating the implant within the disc space. An exemplary instrument can include an inner member having opposed jaws for grasping the implant and holding the implant during insertion. The inner member can be slidably received within an outer member such that relative axial translation of the inner and outer members is effective to open or close the jaws. The jaws and/or the distal end of the outer member can have a low-profile geometry, which can advantageously facilitate certain surgical procedures. For example, the low-profile geometry can allow for a more medial approach to an intervertebral disc space in which the implant is to be inserted.
    Type: Application
    Filed: May 24, 2021
    Publication date: September 9, 2021
    Inventors: Dirk Dittmann, William Miller, Jeff Walker
  • Patent number: 11045331
    Abstract: Implant inserters and related methods are disclosed herein, e.g., for delivering a fusion cage or other implant to a spinal disc space and for rotating or articulating the implant within the disc space. An exemplary instrument can include an inner member having opposed jaws for grasping the implant and holding the implant during insertion. The inner member can be slidably received within an outer member such that relative axial translation of the inner and outer members is effective to open or close the jaws. The jaws and/or the distal end of the outer member can have a low-profile geometry, which can advantageously facilitate certain surgical procedures. For example, the low-profile geometry can allow for a more medial approach to an intervertebral disc space in which the implant is to be inserted.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: June 29, 2021
    Assignee: DePuy Synthes Products, Inc.
    Inventors: Dirk Dittmann, William Miller, Jeff Walker
  • Publication number: 20190046334
    Abstract: Implant inserters and related methods are disclosed herein, e.g., for delivering a fusion cage or other implant to a spinal disc space and for rotating or articulating the implant within the disc space. An exemplary instrument can include an inner member having opposed jaws for grasping the implant and holding the implant during insertion. The inner member can be slidably received within an outer member such that relative axial translation of the inner and outer members is effective to open or close the jaws. The jaws and/or the distal end of the outer member can have a low-profile geometry, which can advantageously facilitate certain surgical procedures. For example, the low-profile geometry can allow for a more medial approach to an intervertebral disc space in which the implant is to be inserted.
    Type: Application
    Filed: August 14, 2018
    Publication date: February 14, 2019
    Inventors: Dirk Dittmann, William Miller, Jeff Walker
  • Patent number: 9636234
    Abstract: A hybrid spinal implant device, and method of making the same are disclosed. The spinal implant device comprises two facing endplates, each having at least one anchoring wall or pin element, and a plastic spacer anchored to and located between the two endplates. The endplates may be manufactured from titanium. The plastic spacer may be manufactured from a radiolucent, and bio-compatible polymer-based material including polyetheretherketone (“PEEK”), polyetherketone, polyetherketoneketone, and/or fiber reinforced plastic. The endplates made of titanium allow for enhanced bone growth, while the plastic/PEEK spacer element allows for improved load absorption and distribution. The spinal implant device, using titanium endplates and a PEEK spacer, provides excellent radiolucency thereby eliminating the need for X-ray markers either intra- or post-operation. The manufacturing method for the hybrid spinal implant device uses injection molding to insert or back injection mold the spacer between the two endplates.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: May 2, 2017
    Assignee: DePuy Synthes Products, Inc.
    Inventors: Andreas Gfeller, Dirk Dittmann, Salman Chegini, Phillippe Lindenmann
  • Patent number: 9549822
    Abstract: The present disclosure relates to a spinal implant or spacer that addresses the variation in anatomy of vertebrae along the spine by having inferior and superior surface angle and convexity variations that are adapted to address the differences in lordosis and endplate surface convexity of the spine. The difference between the convexity of the superior and inferior surface of the spacer increases as the lordotic angle of the spacer increases. The spacers described herein thus provide overall improved fit into vertebral disc space and in some embodiments are even used in the absence of fusion for a prolonged period. The vertebral spacers described herein in some embodiments are used with supplemental internal fixation systems, such as an anchor plate. The interior of the spacer has channels and undercuts to increase graft volume and retention, support bony ingrowth, and bony stability for better secondary and tertiary stabilization.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: January 24, 2017
    Assignee: DePuy Synthes Products, Inc.
    Inventors: David Wimberley, Christopher Cain, Andreas Gfeller, Jared Schoenly, Frank Yohe, David Evans, Dirk Dittmann, Jayr Bass
  • Publication number: 20160089250
    Abstract: A hybrid spinal implant device, and method of making the same are disclosed. The spinal implant device comprises two facing endplates, each having at least one anchoring wall or pin element, and a plastic spacer anchored to and located between the two endplates. The endplates may be manufactured from titanium. The plastic spacer may be manufactured from a radiolucent, and bio-compatible polymer-based material including polyetheretherketone (“PEEK”), polyetherketone, polyetherketoneketone, and/or fiber reinforced plastic. The endplates made of titanium allow for enhanced bone growth, while the plastic/PEEK spacer element allows for improved load absorption and distribution. The spinal implant device, using titanium endplates and a PEEK spacer, provides excellent radiolucency thereby eliminating the need for X-ray markers either intra- or post-operation. The manufacturing method for the hybrid spinal implant device uses injection molding to insert or back injection mold the spacer between the two endplates.
    Type: Application
    Filed: December 9, 2015
    Publication date: March 31, 2016
    Applicant: DePuy Synthes Products, Inc.
    Inventors: Andreas Gfeller, Dirk Dittmann, Salman Chegini, Phillippe Lindenmann
  • Patent number: 9238319
    Abstract: A hybrid spinal implant device, and method of making the same are disclosed. The spinal implant device comprises two facing endplates, each having at least one anchoring wall or pin element, and a plastic spacer anchored to and located between the two endplates. The endplates may be manufactured from titanium. The plastic spacer may be manufactured from a radiolucent, and bio-compatible polymer-based material including polyetheretherketone (“PEEK”), polyetherketone, polyetherketoneketone, and/or fiber reinforced plastic. The endplates made of titanium allow for enhanced bone growth, while the plastic/PEEK spacer element allows for improved load absorption and distribution. The spinal implant device, using titanium endplates and a PEEK spacer, provides excellent radiolucency thereby eliminating the need for X-ray markers either intra- or post-operation. The manufacturing method for the hybrid spinal implant device uses injection molding to insert or back injection mold the spacer between the two endplates.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 19, 2016
    Assignee: DePuy Synthes Products, Inc.
    Inventors: Andreas Gfeller, Dirk Dittmann, Salman Chegini, Philippe Lindenmann
  • Publication number: 20140330383
    Abstract: The present disclosure relates to a spinal implant or spacer that addresses the variation in anatomy of vertebrae along the spine by having inferior and superior surface angle and convexity variations that are adapted to address the differences in lordosis and endplate surface convexity of the spine. The difference between the convexity of the superior and inferior surface of the spacer increases as the lordotic angle of the spacer increases. The spacers described herein thus provide overall improved fit into vertebral disc space and in some embodiments are even used in the absence of fusion for a prolonged period. The vertebral spacers described herein in some embodiments are used with supplemental internal fixation systems, such as an anchor plate. The interior of the spacer has channels and undercuts to increase graft volume and retention, support bony ingrowth, and bony stability for better secondary and tertiary stabilization.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 6, 2014
    Inventors: David Wimberley, Christopher Cain, Andreas Gfeller, Jared Schoenly, Frank Yohe, David Evans, Dirk Dittmann, Joyr Bass
  • Publication number: 20140277482
    Abstract: A hybrid spinal implant device, and method of making the same are disclosed. The spinal implant device comprises two facing endplates, each having at least one anchoring wall or pin element, and a plastic spacer anchored to and located between the two endplates. The endplates may be manufactured from titanium. The plastic spacer may be manufactured from a radiolucent, and bio-compatible polymer-based material including polyetheretherketone (“PEEK”), polyetherketone, polyetherketoneketone, and/or fiber reinforced plastic. The endplates made of titanium allow for enhanced bone growth, while the plastic/PEEK spacer element allows for improved load absorption and distribution. The spinal implant device, using titanium endplates and a PEEK spacer, provides excellent radiolucency thereby eliminating the need for X-ray markers either intra- or post-operation. The manufacturing method for the hybrid spinal implant device uses injection molding to insert or back injection mold the spacer between the two endplates.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: Synthes USA, LLC
    Inventors: Andreas Gfeller, Dirk Dittmann, Salman Chegini, Phillippe Lindenmann
  • Patent number: 8276446
    Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: October 2, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Markus Ulm, Michael Struchholz, Tristan Jobert, Klaus Offterdinger, Thomas Klaus, Christian Gerhardt, Florian Grabmaier, Dirk Dittmann
  • Publication number: 20110233907
    Abstract: A housing for an electrical circuit, in particular for a sensor, pins projecting from the housing for the electrical contacting of the circuit, additional pins being provided which are not connected electrically to the circuit but instead are used as mechanical arrangement for fastening the housing to a printed circuit board in particular. The present invention further relates to a housing having an electrical circuit, in particular a sensor, pins projecting from the housing for the electrical contacting of the circuit, at least two pins being connected to one another mechanically via a connecting piece.
    Type: Application
    Filed: July 29, 2009
    Publication date: September 29, 2011
    Inventors: Michael Struchholz, Tristan Jobert, Klaus Offterdinger, Thomas Klaus, Dirk Dittmann
  • Publication number: 20100192689
    Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.
    Type: Application
    Filed: January 26, 2010
    Publication date: August 5, 2010
    Inventors: Markus Ulm, Michael Struchholz, Tristan Jobert, Klaus Offterdinger, Thomas Klaus, Christian Gerhardt, Florian Grabmaier, Dirk Dittmann
  • Patent number: 6892571
    Abstract: A sensor for measuring a flow speed of a fluid medium includes a housing with a carrier membrane disposed in the housing and being essentially in a form of a vane having a circumference and at least one edge region. Holding elements are arranged over a portion of the circumference connecting the vane to the housing so that only the at least one edge region of the carrier membrane is subjected to mechanical stress caused by the housing. An electrically conductive track with feed lines is installed on the carrier membrane in a region of a neutral fiber for the carrier membrane which does not experience a mechanical strain when the carrier membrane is bent. The electrically conductive track is adapted for being heated relative to the environment by an electrical current flowing through the electrically conductive track.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: May 17, 2005
    Assignee: Forschungszentrum Karlsrue GmbH
    Inventors: Werner Schomburg, Dirk Dittmann, Klaus Schlote-Holubek
  • Publication number: 20040159151
    Abstract: A sensor for measuring a flow speed of a fluid medium includes a housing with a carrier membrane disposed in the housing and being essentially in a form of a vane having a circumference and at least one edge region. Holding elements are arranged over a portion of the circumference connecting the vane to the housing so that only the at least one edge region of the carrier membrane is subjected to mechanical stress caused by the housing. An electrically conductive track with feed lines is installed on the carrier membrane in a region of a neutral fiber for the carrier membrane which does not experience a mechanical strain when the carrier membrane is bent. The electrically conductive track is adapted for being heated relative to the environment by an electrical current flowing through the electrically conductive track.
    Type: Application
    Filed: November 20, 2003
    Publication date: August 19, 2004
    Applicant: Forschungszentrum Karisruhe GmbH
    Inventors: Werner Schomburg, Dirk Dittmann, Klaus Schlote-Holubek
  • Publication number: 20030232120
    Abstract: The present patent application describes a method for producing a grain and fruit mixture, which is characterized in that the fruits to be used are fresh or frozen and are steeped in a sugar-type solution before being mixed into the grain mixture.
    Type: Application
    Filed: June 13, 2003
    Publication date: December 18, 2003
    Applicant: Dr. August Oetker Nahrungsmittel KG
    Inventors: Kati Merten, Dirk Dittmann, Thomas Rusing