Patents by Inventor Dirk GENNERMANN

Dirk GENNERMANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio-frequency antenna, radio-frequency substrate with radio-frequency antenna, and production method
    Patent number: 10602606
    Abstract: A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: March 24, 2020
    Assignee: SCHWEIZER ELECTRONIC AG
    Inventors: Thomas Gottwald, Christian Rössle, Christian Dold, Dirk Gennermann
  • Radio-frequency antenna, radio-frequency substrate with radio-frequency antenna, and production method
    Publication number: 20180220526
    Abstract: A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.
    Type: Application
    Filed: August 9, 2016
    Publication date: August 2, 2018
    Inventors: Thomas GOTTWALD, Christian RÖSSEL, Christian DOLD, Dirk GENNERMANN