Abstract: A modular computer system includes: a housing; at least one container; a data connection; and a housing cover. The at least one container in a lowered state is configured to be connected to a motherboard of the computer system via at least one data connection installed on the outside of the at least one container. The data connection is for exchanging data between pluggable circuit boards in the at least one container and the motherboard of the computer system while the at least one container is in the lowered state. The housing cover is configured to be fixed on the housing. A container holding device is installed on the housing cover, wherein the container holding device is configured to exert a force on the at least one container to fix the at least one container in a shakeproof manner in the housing after the housing cover has been fixed on the housing.

Abstract: A modular computer system includes: a housing; at least one container; a data connection; and a housing cover. The at least one container in a lowered state is configured to be connected to a motherboard of the computer system via at least one data connection installed on the outside of the at least one container. The data connection is for exchanging data between pluggable circuit boards in the at least one container and the motherboard of the computer system while the at least one container is in the lowered state. The housing cover is configured to be fixed on the housing. A container holding device is installed on the housing cover, wherein the container holding device is configured to exert a force on the at least one container to fix the at least one container in a shakeproof manner in the housing after the housing cover has been fixed on the housing.

Abstract: A test bench for a control system for controlling a wideband lambda sensor, which is configured to calculate an actual value, which represents an oxygen concentration in a measuring gap of a wideband lambda sensor or an indicator value from which the oxygen concentration can be derived, with consideration of a current generated by a pump voltage in an electrical circuit. In order to simulate the electrical response of a pump cell of the wideband lambda sensor, a first diode and a second diode are connected in parallel in the electrical circuit such that a current flows through the first diode at a first polarity of the pump voltage and a current flows through the second diode at a second polarity of the pump voltage.

Abstract: An apparatus for testing an electrical component, having a simulation unit for producing a simulation signal, a plurality of test units, and at least one electrical connecting device, whereby the simulation unit and the plurality of test units are connected or connectable to each other in an electrically conductive fashion via the at least one connecting device, and the at least one connecting device has at least one electrical switch device, which is situated to make or break an electrical connection between the plurality of test units.

Abstract: A test bench for a control system for controlling a wideband lambda sensor, which is configured to calculate an actual value, which represents an oxygen concentration in a measuring gap of a wideband lambda sensor or an indicator value from which the oxygen concentration can be derived, with consideration of a current generated by a pump voltage in an electrical circuit. In order to simulate the electrical response of a pump cell of the wideband lambda sensor, a first diode and a second diode are connected in parallel in the electrical circuit such that a current flows through the first diode at a first polarity of the pump voltage and a current flows through the second diode at a second polarity of the pump voltage.

Abstract: A method for laminating a substrate component to a thermally deformable decorative layer in a tool in which, for laminating, the decorative layer is held so as to be pre-tensioned in a holding device or in the tool and is placed on a substrate layer that rests on the tool, where prior to placing the decorative layer on the substrate component the second side of a molding contour piece that can be moved relative to the decorative layer is made to contact the pre-heated decorative layer, and by way of a further relative movement of the decorative layer relative to the holding device deforms the decorative layer in one section.

Abstract: A method for implementing an adaptive interface between at least one FPGA with at least one FPGA application and at least one I/O module, which are designed as the corresponding sender side or receiver side, for connection to the FPGA, whereby a serial interface is formed between the at least one FPGA and the at least one I/O module, comprising the steps of configuring a maximum number of registers to be transmitted for each FPGA application, configuring a shared, fixed register width for all registers, setting an enable signal on the sender side for the registers to be transmitted out of the maximum number of registers to be transmitted, transmitting the enable signal from the sender side to the receiver side, and transmitting the registers, for which the enable signal is set, from the sender side to the receiver side.

Abstract: An apparatus for testing an electrical component, having a simulation unit for producing a simulation signal, a plurality of test units, and at least one electrical connecting device, whereby the simulation unit and the plurality of test units are connected or connectable to each other in an electrically conductive fashion via the at least one connecting device, and the at least one connecting device has at least one electrical switch device, which is situated to make or break an electrical connection between the plurality of test units.

Abstract: An apparatus for measuring electrical variables includes an external measuring connection, and a converter that converts a plurality of measurement variables into respective electrical measurement variables of a single predefined type. A control device for controlling the converter is provided and at least one type of variable to be measured with the converter can be selected via the control device, and a converter for at least two types of variables to be measured respectively has at least one independent input stage that can be used to detect the measurement variable of the type to be measured and to convert it into a predefined or predefinable type of variable. An electrical signal provided at the measuring connection is analysed in a parallel manner with respect to at least two different criteria via at least two input stages for different types of variables to be measured.

Abstract: A method for implementing an adaptive interface between at least one FPGA with at least one FPGA application and at least one I/O module, which are designed as the corresponding sender side or receiver side, for connection to the FPGA, whereby a serial interface is formed between the at least one FPGA and the at least one I/O module, comprising the steps of configuring a maximum number of registers to be transmitted for each FPGA application, configuring a shared, fixed register width for all registers, setting an enable signal on the sender side for the registers to be transmitted out of the maximum number of registers to be transmitted, transmitting the enable signal from the sender side to the receiver side, and transmitting the registers, for which the enable signal is set, from the sender side to the receiver side.

Abstract: A device for testing an electrical component is provided, having a simulation device for generating a simulation signal, a testing device for connecting the electrical component, at least two connecting devices, and a selection device for selecting the connecting device, wherein the simulation device and the testing device can be connected in an electrically conducting manner to at least one of the connecting devices by the selection device and the individual connecting devices differ from one another in at least one electrical property. Thus, a device for testing an electrical component is provided with which in a simple manner the testing accuracy can be increased by minimizing the signal corruption due to a parasitic property of the connecting device.

Abstract: An enclosure for electronic assemblies is provided, with a first deck surface and a first side wall with a short side and a long side and a second deck surface, disposed such that it faces the first deck surface, and a second side wall, disposed such that it faces the first side wall, with a short side and a long side, as well as with a first venting element, which extends in the direction of the long side along one of both side walls, and a plurality of plug-in slots for electronic assemblies that are arranged in parallel to one another, whereby the electronic assemblies are disposed, in the plugged-in state, vertically to both long sides of both side walls, and the first deck surface includes, along the end oriented toward the first side wall, a first opening and the first venting element, on the enclosure's outer side of the first deck surface, is disposed at least partially above the first opening, and the first and/or the second deck surface includes a second opening, along the end that faces the second

Abstract: An apparatus for measuring electrical variables includes an external measuring connection, and a converter that converts a plurality of measurement variables into respective electrical measurement variables of a single predefined type. A control device for controlling the converter is provided and at least one type of variable to be measured with the converter can be selected via the control device, and a converter for at least two types of variables to be measured respectively has at least one independent input stage that can be used to detect the measurement variable of the type to be measured and to convert it into a predefined or predefinable type of variable. An electrical signal provided at the measuring connection is analysed in a parallel manner with respect to at least two different criteria via at least two input stages for different types of variables to be measured.

Abstract: A method for laminating a substrate component to a thermally deformable decorative layer in a tool in which, for laminating, the decorative layer is held so as to be pre-tensioned in a holding device or in the tool and is placed on a substrate layer that rests on the tool, where prior to placing the decorative layer on the substrate component the second side of a moulding contour piece that can be moved relative to the decorative layer is made to contact the pre-heated decorative layer, and by way of a further relative movement of the decorative layer relative to the holding device deforms the decorative layer in one section.

Abstract: A device for testing an electrical component is provided, having a simulation device for generating a simulation signal, a testing device for connecting the electrical component, at least two connecting devices, and a selection device for selecting the connecting device, wherein the simulation device and the testing device can be connected in an electrically conducting manner to at least one of the connecting devices by the selection device and the individual connecting devices differ from one another in at least one electrical property. Thus, a device for testing an electrical component is provided with which in a simple manner the testing accuracy can be increased by minimizing the signal corruption due to a parasitic property of the connecting device.

Abstract: An enclosure for electronic assemblies is provided, with a first deck surface and a first side wall with a short side and a long side and a second deck surface, disposed such that it faces the first deck surface, and a second side wall, disposed such that it faces the first side wall, with a short side and a long side, as well as with a first venting element, which extends in the direction of the long side along one of both side walls, and a plurality of plug-in slots for electronic assemblies that are arranged in parallel to one another, whereby the electronic assemblies are disposed, in the plugged-in state, vertically to both long sides of both side walls, and the first deck surface includes, along the end oriented toward the first side wall, a first opening and the first venting element, on the enclosure's outer side of the first deck surface, is disposed at least partially above the first opening, and the first and/or the second deck surface includes a second opening, along the end that faces the second

Abstract: A double walled vehicle door having an inside door panel and an outside door panel forming a space therebetween. The inside door panel having at least one cutout therein. A module carrier is attached to the inside door panel such that the module carrier covers and peripherally seals the at least one cutout. A dual cable window lift having guide bars each having a lower end with an associated pulley mounted thereon and an upper end with an associated pulley mounted thereon. The dual cable window lift being mounted on the module carrier such that the lower ends of the guide bars extend beyond a periphery of the module carrier and the upper ends of the guide bars are positioned within the periphery of the module carrier. The upper ends of the guide bars are mounted on a side of the inside door panel adapted to face an interior of the vehicle.

Abstract: A device for fastening a lock module including at least one lock part, an actuating part, and a covering on a module support which is provided for a two-shelled vehicle door and supports the function modules of the vehicle door. A supporting arm which is elastic in a longitudinal direction, polydirectionally pliable, and thus capable of being readjusted, is fastened to the module support. The supporting arm fixes the lock module in the installation position in an unsupported and resilient manner via a supporting plate. The supporting arm is constructed with a tubular shape in order to accommodate a Bowden pull wire for the actuating part of the lock module and/or electric cable.