Abstract: The inventive concept is based on the inventors' realization that by providing a sorting device for a robotic system that has two tubes being telescopically arranged and resiliently separated with a springing means, the picking and releasing of heavy objects may be improved. The inventive concept includes a method and system for conducting the sorting with a robotic arm and suction gripping system.

Abstract: The embodiments herein relate to methods for processing a wafer through a semiconductor wafer processing system and an apparatus. According to an aspect of the present disclosure, a system for processing a semiconductor wafer is provided. The system includes a heating system, a pressure control system, and a gas flow system. The heating system is configured for heating a chuck. The pressure control system is configured for setting an internal chamber pressure. The gas flow system is configured for inflowing a gas in the process chamber to increase the internal chamber pressure to at least a base pressure. The heating system heats the chuck after the internal chamber pressure reaches the base pressure set by the pressure control system.

Abstract: The embodiments herein relate to methods for processing a wafer through a semiconductor wafer processing system and an apparatus. According to an aspect of the present disclosure, a system for processing a semiconductor wafer is provided. The system includes a heating system, a pressure control system, and a gas flow system. The heating system is configured for heating a chuck. The pressure control system is configured for setting an internal chamber pressure. The gas flow system is configured for inflowing a gas in the process chamber to increase the internal chamber pressure to at least a base pressure.

Abstract: One illustrative system disclosed herein includes a process chamber positioned within a processing tool and a wafer chuck that is adapted to be positioned at a wafer processing position located within the process chamber and at a chuck wafer transfer position located outside of the process chamber.

Abstract: One illustrative system disclosed herein includes a process chamber positioned within a processing tool and a wafer chuck that is adapted to be positioned at a wafer processing position located within the process chamber and at a chuck wafer transfer position located outside of the process chamber.

Abstract: A method of treating a semiconductor device is provided including the steps of loading the semiconductor device in a processing chamber, pressurizing the processing chamber by supplying a processing gas from a pressure chamber to the processing chamber, performing a thermal anneal of the semiconductor device in the processing chamber, and depressurizing the processing chamber by supplying the processing gas from the processing chamber to the pressure chamber.

Abstract: A method of treating a semiconductor device is provided including the steps of loading the semiconductor device in a processing chamber, pressurizing the processing chamber by supplying a processing gas from a pressure chamber to the processing chamber, performing a thermal anneal of the semiconductor device in the processing chamber, and depressurizing the processing chamber by supplying the processing gas from the processing chamber to the pressure chamber.