Abstract: A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1) wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger (7) having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall (6) is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.

Abstract: Device (1) comprising a multitude of server modules (3). The server modules (3) are removable, are substantially plate shaped and extend parallel to each other. Each one of the server modules (3) is connected to cable passages (61a) of a first switch (4) by first data cables (6a) and to cable passages (61b) of a second switch (4) by second data cables (6b. The first switch (4) extends perpendicular to and adjacent an edge of the server modules (3) The cable passages (61a) of said first switch (4) extend in a first array and the cable passages (61b) of said second switch (4) extend in a second array. The second array of cable passages (61b) is mounted on a bracket (7) which is mounted on the second switch (4). The bracket (7) extends at a distance from the second switch (4) and from the first array.

Abstract: Device (1) comprising a multitude of server modules (3), wherein said server modules (3) are removable, are substantially plate shaped and extend parallel to each other, wherein each one of said server modules (3) is connected to cable passages (61a) of a first switch (4) by first data cables (6a) and to cable passages (61b) of a second switch (4) by second data cables (6b), wherein said first and second switches (4) are removable, are shaped substantially as a flat box and extend parallel to and adjacent each other, and said first switch (4) extends perpendicular to and adjacent an edge of said server modules (3), wherein said cable passages (61a) of said first switch (4) extend in a first array and the cable passages (61b) of said second switch (4) extend in a second array, wherein said first and second arrays extend parallel to each other, and wherein said first array of cable passages (61a) extends near an edge of said first switch and near said edge of said server modules (3), and wherein said second arr

Abstract: A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1) wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger (7) having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall (6) is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.