Patents by Inventor Dirk Rohde
Dirk Rohde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210262105Abstract: The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising: one to three quinoline group and one or more polyethylene glycol group, wherein, in each said quinoline-polyethylene glycol containing compound, one to three of said one to three quinoline group is connected via one or more oxygen atom of said one or more polyethylene glycol group via carbon 6 or carbon 8 of said one to three quinoline group.Type: ApplicationFiled: May 10, 2021Publication date: August 26, 2021Inventors: Kun SI, Ralf SCHMIDT, Onas BOLTON, Josef GAIDA, Frank VON HORSTEN, Dirk ROHDE, Himendra JHA, Jens PALM, Olivier MANN, Angela LLAVONA-SERRANO
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Patent number: 11091849Abstract: An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising a source of nickel ions, and optionally a source of ions of at least one alloying metal, at least one buffering agent, at least one of a dimer of a compound of formula (I) or mixtures thereof wherein R1 is a substituted or unsubstituted alkenyl group, R2 may be present or not, and if present R2 is a —(CH2)n—SO3? group, wherein n is an integer in the range of 1-6, and wherein one or more of the hydrogens in the group may be replaced by a substituent, preferably hydroxide; and a method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy with said aqueous bath.Type: GrantFiled: September 13, 2018Date of Patent: August 17, 2021Assignee: Atotech Deutschland GmbHInventors: Josef Gaida, Jan Sperling, Mauro Castellani, Grigory Vazhenin, Stefanie Ackermann, Heiko Brunner, Dirk Rohde
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Patent number: 11035051Abstract: The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.Type: GrantFiled: August 10, 2017Date of Patent: June 15, 2021Assignee: Atotech Deutschland GmbHInventors: Kun Si, Ralf Schmidt, Onas Bolton, Josef Gaida, Frank Von Horsten, Dirk Rohde, Himendra Jha, Jens Palm, Olivier Mann, Angela Llavona-Serrano
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Publication number: 20200392637Abstract: An aqueous indium or indium alloy plating bath comprising a source of indium ions, an acid, a source of halide ions, a surfactant according to formula (I) wherein A is selected from branched or unbranched C10-C15-alkyl; B is selected from the group consisting of hydrogen and alkyl; m is an integer ranging from 5 to 25; each R is independently from each other selected from hydrogen and methyl; and a dihydroxybenzene derivative according to formula (II) wherein each X is independently selected from fluorine, chlorine, bromine, iodine, alkoxy, and nitro; n is an integer ranging from 1 to 4, wherein, when the aqueous indium or indium alloy plating bath is an indium alloy plating bath, an alloying reducible metal is selected from the group consisting of aluminum, bismuth, copper, gold, lead, nickel, silver, tin, tungsten and zinc.Type: ApplicationFiled: August 28, 2020Publication date: December 17, 2020Inventors: Jan SPERLING, Stefan PIEPER, Grigory VAZHENIN, Mauro CASTELLANI, Andreas KIRBS, Dirk ROHDE
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Patent number: 10793962Abstract: An aqueous indium or indium alloy plating bath comprising a source of indium ions, an acid, a source of halide ions, a surfactant according to formula (I) wherein A is selected from branched or unbranched C10-C15-alkyl; B is selected from the group consisting of hydrogen and alkyl; m is an integer ranging from 5 to 25; each R is independently from each other selected from hydrogen and methyl; and a dihydroxybenzene derivative according to formula (II) wherein each X is independently selected from fluorine, chlorine, bromine, iodine, alkoxy, and nitro; n is an integer ranging from 1 to 4, and a process for deposition of indium or an indium alloy wherein the disclosed bath is used.Type: GrantFiled: January 25, 2017Date of Patent: October 6, 2020Assignee: Atotech Deutschland GmbHInventors: Jan Sperling, Stefan Pieper, Grigory Vazhenin, Mauro Castellani, Andreas Kirbs, Dirk Rohde
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Patent number: 10753007Abstract: The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps i. providing a substrate having at least one metal or metal alloy surface; ii. depositing a first indium or indium alloy layer on at least one portion of said surface whereby a composed phase layer is formed of a part of the metal or metal alloy surface and a part of the first indium or indium alloy layer; iii. removing partially or wholly the part of the first indium or indium alloy layer which has not been formed into the composed phase layer; iv. depositing a second indium or indium alloy layer on the at least one portion of the surface obtained in step iii.Type: GrantFiled: October 4, 2016Date of Patent: August 25, 2020Assignee: Atotech Deutschland GmbHInventors: Grigory Vazhenin, Jan Sperling, Stefan Pieper, Mauro Castellani, Andreas Kirbs, Dirk Rohde
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Publication number: 20200199766Abstract: An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising a source of nickel ions, and optionally a source of ions of at least one alloying metal, at least one buffering agent, at least one of a dimer of a compound of formula (I) or mixtures thereof wherein R1 is a substituted or unsubstituted alkenyl group, R2 may be present or not, and if present R2 is a —(CH2)n-SO3? group, wherein n is an integer in the range of 1-6, and wherein one or more of the hydrogens in the group may be replaced by a substituent, preferably hydroxide; and a method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy with said aqueous bath.Type: ApplicationFiled: September 13, 2018Publication date: June 25, 2020Inventors: Josef GAIDA, Jan SPERLING, Mauro CASTELLANI, Grigory VAZHENIN, Stefanie ACKERMANN, Heiko BRUNNER, Dirk ROHDE
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Patent number: 10633755Abstract: The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and/or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.Type: GrantFiled: September 9, 2016Date of Patent: April 28, 2020Assignee: Atotech Deutschland GmbHInventors: Dirk Rohde, Jens Palm
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Patent number: 10538850Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.Type: GrantFiled: April 20, 2016Date of Patent: January 21, 2020Assignee: Atotech Deutschland GmbHInventors: Heiko Brunner, Dirk Rohde, Manuel Pölleth, Sven Rückbrod, Desthree Darwin, Sandra Niemann, Gerhard Steinberger
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Publication number: 20190203369Abstract: The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.Type: ApplicationFiled: August 10, 2017Publication date: July 4, 2019Inventors: Kun SI, Ralf SCHMIDT, Onas BOLTON, Josef GAIDA, Frank VON HORSTEN, Dirk ROHDE, Himendra JHA, Jens PALM, Olivier MANN, Angela LLAVONA-SERRANO
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Publication number: 20180355500Abstract: An aqueous indium or indium alloy plating bath comprising a source of indium ions, an acid, a source of halide ions, a surfactant according to formula (I) wherein A is selected from branched or unbranched C10-C15-alkyl; B is selected from the group consisting of hydrogen and alkyl; m is an integer ranging from 5 to 25; each R is independently from each other selected from hydrogen and methyl; and a dihydroxybenzene derivative according to formula (II) wherein each X is independently selected from fluorine, chlorine, bromine, iodine, alkoxy, and nitro; n is an integer ranging from 1 to 4, and a process for deposition of indium or an indium alloy wherein said bath is used.Type: ApplicationFiled: January 25, 2017Publication date: December 13, 2018Inventors: Jan SPERLING, Stefan PIEPER, Grigory VAZHENIN, Mauro CASTELLANI, Andreas KIRBS, Dirk ROHDE
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Publication number: 20180298511Abstract: The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps i. providing a substrate having at least one metal or metal alloy surface; ii. depositing a first indium or indium alloy layer on at least one portion of said surface whereby a composed phase layer is formed of a part of the metal or metal alloy surface and a part of the first indium or indium alloy layer; iii. removing partially or wholly the part of the first indium or indium alloy layer which has not been formed into the composed phase layer; iv. depositing a second indium or indium alloy layer on the at least one portion of the surface obtained in step iii. v.Type: ApplicationFiled: October 4, 2016Publication date: October 18, 2018Inventors: Grigory VAZHENIN, Jan SPERLING, Stefan PIEPER, Mauro CASTELLANI, Andreas KIRBS, Dirk ROHDE
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Publication number: 20180237932Abstract: The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and/or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.Type: ApplicationFiled: September 9, 2016Publication date: August 23, 2018Inventors: Dirk ROHDE, Jens PALM
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Publication number: 20180112320Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.Type: ApplicationFiled: April 20, 2016Publication date: April 26, 2018Applicant: Atotech Deutschland GmbHInventors: Heiko BRUNNER, Dirk ROHDE, Manuel PÖLLETH, Sven RÜCKBROD, Desthree DARWIN, Sandra NIEMANN, Gerhard STEINBERGER
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Patent number: 9551080Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.Type: GrantFiled: November 12, 2013Date of Patent: January 24, 2017Assignee: Atotech Deutschland GmbHInventors: Heiko Brunner, Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann, Christian Ohde, Timo Bangerter, Angelo Ferro, Andreas Kirbs, Andre Schmökel, Dirk Rohde, Stefanie Ackermann
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Patent number: 9506158Abstract: A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.Type: GrantFiled: May 7, 2012Date of Patent: November 29, 2016Assignee: Atotech Deutschland GmbHInventors: Dirk Rohde, Bernd Roelfs, Jun Higuchi
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Publication number: 20150299883Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.Type: ApplicationFiled: November 12, 2013Publication date: October 22, 2015Inventors: Heiko BRUNNER, Bernd ROELFS, Agnieszka WITCZAK, Lars KOHLMANN, Olivier MANN, Christian OHDE, Timo BANGERTER, Angelo FERRO, Andreas KIRBS, Andre SCHMÖKEL, Dirk ROHDE, Stefanie ACKERMANN
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Publication number: 20140102910Abstract: A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to said heterocyclic core by a spacer is disclosed. Said method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.Type: ApplicationFiled: May 7, 2012Publication date: April 17, 2014Applicant: Atotech Deutschland GmbHInventors: Dirk Rohde, Bernd Roelfs, Jun Higuchi
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Patent number: 8679316Abstract: An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.Type: GrantFiled: April 27, 2009Date of Patent: March 25, 2014Assignee: Atotech Deutschland GmbHInventors: Heiko Brunner, Bernd Roelfs, Dirk Rohde, Thomas Pliet
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Publication number: 20110011746Abstract: To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids.Type: ApplicationFiled: April 27, 2009Publication date: January 20, 2011Applicant: ATOTECH DEUTSCHLAND GMBHInventors: Heiko Brunner, Bernd Roelfs, Dirk Rohde, Thomas Pliet