Patents by Inventor Dirk Seehase

Dirk Seehase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heating element for SMD mounting
    Patent number: 9986648
    Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: May 29, 2018
    Assignees: SIEMENS AKTIENGESELLSCHAFT, KLEB-UND GIESSHARZTECHNIK DR. LUDECK GMBH
    Inventors: Michael Hanisch, Heiko Huth, Wolfgang Ludeck, Bernd Mueller, Mathias Nowottnick, Andrey Prihodovsky, Dirk Seehase, Ulrich Wittreich, Dirk Wormuth
  • Heating Element For SMD Mounting
    Publication number: 20180110131
    Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
    Type: Application
    Filed: March 29, 2016
    Publication date: April 19, 2018
    Applicants: Siemens Aktiengesellschaft, Kleb- und Giessharztechnik Dr. Ludeck GmbH
    Inventors: Michael Hanisch, Heiko Huth, Wolfgang Ludeck, Bernd Mueller, Mathias Nowottnick, Andrey Prihodovsky, Dirk Seehase, Ulrich Wittreich, Dirk Wormuth