Patents by Inventor Dirk Wagenaar

Dirk Wagenaar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-relay
    Patent number: 6765300
    Abstract: A microstructure relay is provided, having a body that includes upper and lower portions. The lower portion is formed from a substrate, and the upper portion is formed on the substrate to avoid bonding of the lower portion to the upper portion. A support member is fixed to the body at a first end of the support member to form a cantilever, wherein an upper surface of the support member and a lower surface of the upper portion of the body form a cavity. A first contact region is located on the upper surface at a second end of the support member. The first contact region comprises a first contact, wherein pivoting the support member toward the lower surface causes the first contact to be electrically coupled to a counter contact.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: July 20, 2004
    Assignees: Tyco Electronics Logistics, AG, Institute of Microelectronics
    Inventors: Dirk Wagenaar, Kay Krupka, Helmut Schlaak, Uppili Sridhar, Victor D. Samper, Pang Dow Foo