Patents by Inventor Dishit Paresh Parekh
Dishit Paresh Parekh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230335355Abstract: A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency, the droplet can spread, allowing at least two conductors to be coupled.Type: ApplicationFiled: June 23, 2023Publication date: October 19, 2023Inventors: Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier, Benjamin Stassen Cook
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Patent number: 11791270Abstract: A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.Type: GrantFiled: May 10, 2021Date of Patent: October 17, 2023Assignee: International Business Machines CorporationInventors: Kamal K Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort, Dale Curtis McHerron, Vijayeshwar Das Khanna, Marc A. Bergendahl, Dishit Paresh Parekh, Ravi K. Bonam, Hiroyuki Mori, Yang Liu, Paul S. Andry, Isabel De Sousa
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Patent number: 11728111Abstract: A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency the droplet can spread allowing at least two conductors to be coupled.Type: GrantFiled: December 27, 2018Date of Patent: August 15, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier, Benjamin Stassen Cook
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Publication number: 20220359401Abstract: A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.Type: ApplicationFiled: May 10, 2021Publication date: November 10, 2022Inventors: Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort, Dale Curtis McHerron, Vijayeshwar Das Khanna, Marc A. Bergendahl, Dishit Paresh Parekh, RAVI K. BONAM, HIROYUKI MORI, Yang Liu, Paul S. Andry, Isabel De Sousa
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Patent number: 10879151Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.Type: GrantFiled: December 28, 2018Date of Patent: December 29, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dishit Paresh Parekh, Benjamin Stassen Cook, Daniel Lee Revier, Jo Bito
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Publication number: 20200211798Abstract: A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency the droplet can spread allowing at least two conductors to be coupled.Type: ApplicationFiled: December 27, 2018Publication date: July 2, 2020Inventors: Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier, Benjamin Stassen Cook
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Publication number: 20200211928Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.Type: ApplicationFiled: December 28, 2018Publication date: July 2, 2020Inventors: Dishit Paresh PAREKH, Benjamin Stassen COOK, Daniel Lee REVIER, Jo BITO
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Patent number: 10431726Abstract: Flexible thermoelectric generators and methods of manufacturing are disclosed. In one embodiment, a flexible thermoelectric generator includes a plurality of pillars, a first and a second plurality of flexible interconnects, and a flexible material. The plurality of pillars having a first side and a second side. The first plurality of flexible interconnects electrically connecting pairs of the plurality of pillars on the first side. The second plurality of flexible interconnects electrically connecting the pairs of plurality of pillars on the second side. The first and the second plurality of flexible interconnects alternate among the pairs of plurality of pillars to form an electrical circuit having a first end and a second end. The flexible material covering the first and second plurality of flexible interconnects and having an external surface. The flexible material is configured to conduct thermal energy from the external surface to the plurality of pillars.Type: GrantFiled: May 2, 2017Date of Patent: October 1, 2019Assignee: North Carolina State UniversityInventors: Mehmet Ozturk, Michael D. Dickey, Collin Ladd, Dishit Paresh Parekh, Viswanath Padmanabhan Ramesh, Francisco Suarez
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Publication number: 20170317261Abstract: Flexible thermoelectric generators and methods of manufacturing are disclosed. In one embodiment, a flexible thermoelectric generator includes a plurality of pillars, a first and a second plurality of flexible interconnects, and a flexible material. The plurality of pillars having a first side and a second side. The first plurality of flexible interconnects electrically connecting pairs of the plurality of pillars on the first side. The second plurality of flexible interconnects electrically connecting the pairs of plurality of pillars on the second side. The first and the second plurality of flexible interconnects alternate among the pairs of plurality of pillars to form an electrical circuit having a first end and a second end. The flexible material covering the first and second plurality of flexible interconnects and having an external surface. The flexible material is configured to conduct thermal energy from the external surface to the plurality of pillars.Type: ApplicationFiled: May 2, 2017Publication date: November 2, 2017Inventors: Mehmet Ozturk, Michael D. Dickey, Collin Ladd, Dishit Paresh Parekh, Viswanath Padmanabhan Ramesh, Francisco Suarez