Patents by Inventor Divya Swamy Bandaru

Divya Swamy Bandaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions
    Patent number: 11557529
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • Method and apparatus for detaching a microprocessor from a heat sink
    Patent number: 11296009
    Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Rolf Laido, Divya Swamy Bandaru, Thomas Boyd, Jorge Contreras Perez, Shelby A. Ferguson, Mustafa Haswarey
  • All-inclusive CPU carrier that enable automation and tool free operation at low-cost while improving thermal performance
    Patent number: 11271335
    Abstract: Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: March 8, 2022
    Assignee: Intel Corporation
    Inventors: Mustafa H. Haswarey, Ming-Chen Chang, Divya Swamy Bandaru
  • ALL-INCLUSIVE CPU CARRIER THAT ENABLE AUTOMATION AND TOOL FREE OPERATION AT LOW-COST WHILE IMPROVING THERMAL PERFORMANCE
    Publication number: 20190393631
    Abstract: Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 26, 2019
    Inventors: Mustafa H. HASWAREY, Ming-Chen CHANG, Divya Swamy BANDARU
  • MECHANISM COMBINING FASTENER CAPTIVATION AND ASSEMBLY TILT CONTROL FOR MICROPROCESSOR THERMAL SOLUTIONS
    Publication number: 20190304870
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Applicant: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK
    Publication number: 20190304871
    Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Applicant: Intel Corporation
    Inventors: Rolf Laido, Divya Swamy Bandaru, Thomas Boyd, Jorge Contreras Perez, Shelby A. Ferguson, Mustafa Haswarey