Abstract: In the preparation of copper parts for the tape automated bonding of semiconductor devices, the copper parts are subjected to a mild organic acid. This treatment etches the copper, removes contaminants and passivates the surfaces so that subsequent oxidation is retarded. In the case where the copper parts are the bumps on a semiconductor wafer selective etching is avoided.

Abstract: An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.