Patents by Inventor Dixit Desai
Dixit Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240055242Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.Type: ApplicationFiled: October 25, 2023Publication date: February 15, 2024Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
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Patent number: 11837447Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.Type: GrantFiled: April 28, 2021Date of Patent: December 5, 2023Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
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Publication number: 20220189747Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.Type: ApplicationFiled: April 28, 2021Publication date: June 16, 2022Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
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Patent number: 9184072Abstract: An apparatus and method are described for processing workpieces in a treatment process. A multi-wafer chamber defines a chamber interior including at least two processing stations within the chamber interior such that the processing stations share the chamber interior. Each processing station includes a plasma source and a workpiece pedestal for exposing one of the workpieces to the treatment process using a respective plasma source. The chamber includes an arrangement of one or more electrically conductive surfaces that are asymmetrically disposed about the workpiece at each processing station in a way which produces a given level of uniformity of the treatment process on a major surface of each workpiece. A shield arrangement provides an enhanced uniformity of exposure of the workpiece to the respective one of the plasma sources that is greater than the given level of uniformity that would be provided in an absence of the shield arrangement.Type: GrantFiled: July 27, 2007Date of Patent: November 10, 2015Assignee: Mattson Technology, Inc.Inventors: Daniel J. Devine, Charles Crapuchettes, Dixit Desai, Rene George, Vincent C. Lee, Yuya Matsuda, Jonathan Mohn, Ryan M. Pakulski, Stephen E. Savas, Martin Zucker
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Patent number: 8066815Abstract: A multi-workpiece chamber includes at least two processing stations, for exposing workpieces to a treatment process. A partition cooperates with the chamber such that the partition is disengagably removable from the chamber and re-engagable with the chamber for selectively dividing the processing stations. The partition is configured to provide for non-line-of-sight travel of certain ones of the process related products between the processing stations. An exhaust arrangement divides exhaust flow into at least two approximately equal exhaust flow portions that leave the multi-workpiece chamber in a way which enhances uniformity of the treatment process for the stations. A partition configuration is described including a partition portion between the stations and a baffle portion extending into an exhaust arrangement. A modified partition arrangement is provided for use in establishing a modified exchange characteristic of the process related products.Type: GrantFiled: August 15, 2007Date of Patent: November 29, 2011Assignee: Mattson Technology, Inc.Inventors: Daniel J. Devine, Rene George, Ce Qin, Dixit Desai
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Publication number: 20090028761Abstract: An apparatus and method are described for processing workpieces in a treatment process. A multi-wafer chamber defines a chamber interior including at least two processing stations within the chamber interior such that the processing stations share the chamber interior. Each processing station includes a plasma source and a workpiece pedestal for exposing one of the workpieces to the treatment process using a respective plasma source. The chamber includes an arrangement of one or more electrically conductive surfaces that are asymmetrically disposed about the workpiece at each processing station in a way which produces a given level of uniformity of the treatment process on a major surface of each workpiece. A shield arrangement provides an enhanced uniformity of exposure of the workpiece to the respective one of the plasma sources that is greater than the given level of uniformity that would be provided in an absence of the shield arrangement.Type: ApplicationFiled: July 27, 2007Publication date: January 29, 2009Inventors: Daniel J. Devine, Charles Crapuchettes, Dixit Desai, Rene George, Vincent C. Lee, Yuya Matsuda, Jonathan Mohn, Ryan M. Pakulski, Stephen E. Savas, Martin Zucker
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Publication number: 20070281085Abstract: A multi-workpiece chamber includes at least two processing stations, for exposing workpieces to a treatment process. A partition cooperates with the chamber such that the partition is disengagably removable from the chamber and re-engagable with the chamber for selectively dividing the processing stations. The partition is configured to provide for non-line-of-sight travel of certain ones of the process related products between the processing stations. An exhaust arrangement divides exhaust flow into at least two approximately equal exhaust flow portions that leave the multi-workpiece chamber in a way which enhances uniformity of the treatment process for the stations. A partition configuration is described including a partition portion between the stations and a baffle portion extending into an exhaust arrangement. A modified partition arrangement is provided for use in establishing a modified exchange characteristic of the process related products.Type: ApplicationFiled: August 15, 2007Publication date: December 6, 2007Inventors: Daniel Devine, Rene George, Ce Oin, Dixit Desai
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Patent number: 7276122Abstract: A multi-workpiece chamber includes at least two processing stations, for exposing workpieces to a treatment process. A partition cooperates with the chamber such that the partition is disengagably removable from the chamber and re-engagable with the chamber for selectively dividing the processing stations. The partition is configured to provide for non-line-of-sight travel of certain ones of the process related products between the processing stations. An exhaust arrangement divides exhaust flow into at least two approximately equal exhaust flow portions that leave the multi-workpiece chamber in a way which enhances uniformity of the treatment process for the stations. A partition configuration is described including a partition portion between the stations and a baffle portion extending into an exhaust arrangement. A modified partition arrangement is provided for use in establishing a modified exchange characteristic of the process related products.Type: GrantFiled: April 21, 2004Date of Patent: October 2, 2007Assignee: Mattson Technology, Inc.Inventors: Daniel J. Devine, Rene George, Ce Qin, Dixit Desai
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Publication number: 20050247265Abstract: A multi-workpiece chamber includes at least two processing stations, for exposing workpieces to a treatment process. A partition cooperates with the chamber such that the partition is disengagably removable from the chamber and re-engagable with the chamber for selectively dividing the processing stations. The partition is configured to provide for non-line-of-sight travel of certain ones of the process related products between the processing stations . An exhaust arrangement divides exhaust flow into at least two approximately equal exhaust flow portions that leave the multi-workpiece chamber in a way which enhances uniformity of the treatment process for the stations. A partition configuration is described including a partition portion between the stations and a baffle portion extending into an exhaust arrangement. A modified partition arrangement is provided for use in establishing a modified exchange characteristic of the process related products.Type: ApplicationFiled: April 21, 2004Publication date: November 10, 2005Inventors: Daniel Devine, Rene George, Ce Qin, Dixit Desai