Abstract: An apparatus and/or process for applying a weld overlay to a nozzle or piping spool of complex configuration is disclosed.

Abstract: An apparatus and/or process for applying a weld overlay to a nozzle or piping spool of complex configuration is disclosed. In an exemplary embodiment, the welding apparatus comprises a mounting assembly having a plurality of magnetic foot pads, a tension support rod attached at one end to one of the magnetic foot pads, an upper attachment pad at the opposite end of the rod, and a bottom attachment pad attached to at least one other magnetic foot pad; a travel guide, the travel guide attached to the upper attachment pad at one end and the bottom attachment pad at the other end; and a head assembly attached to the travel guide, the head assembly having: i) a track ring assembly having an inner ring and an outer ring, ii.) at least two opposed weld heads attached to the inner track ring, iii.) at least one movable wire feed drive mechanism on the track ring, and iv.

Abstract: An apparatus and/or process for applying a weld overlay to a nozzle or piping spool of complex configuration is disclosed. In an exemplary embodiment, the welding apparatus comprises a mounting assembly having a plurality of magnetic foot pads, a tension support rod attached at one end to one of the magnetic foot pads, an upper attachment pad at the opposite end of the rod, and a bottom attachment pad attached to at least one other magnetic foot pad; a travel guide, the travel guide attached to the upper attachment pad at one end and the bottom attachment pad at the other end; and a head assembly attached to the travel guide, the head assembly having: i) a track ring assembly having an inner ring and an outer ring, ii.) at least two opposed weld heads attached to the inner track ring, iii.) at least one movable wire feed drive mechanism on the track ring, and iv.

Abstract: A process for forming stable integrated resistors (14) and capacitors (28) on organic substrates (12). The resistors (14) and capacitors (28) are capable of a wide range of resistance and capacitance values, yet can be processed in a manner that does not detrimentally effect the organic substrate (12) or entail complicated processing. The method generally entails the use of thick-film materials usually of the types used to form resistors and capacitors on ceramic substrates. The thick-film materials are applied to an electrically-conductive foil (20) and then heated to bond the thick-film material to the foil (20) and form a solid resistive or capacitive mass (16/30). The foil (20) is then laminated to an organic substrate (12), such that the resistive/capacitive mass (16/30) is attached to and preferably embedded in the organic substrate (12).