Patents by Inventor Django Earl Trombley

Django Earl Trombley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 10262957
    Abstract: An integrated circuit (IC) package includes an IC die and a wave channel that electrically couples the IC die to a solder ball array. The wave channel is configured to resonate at an operating frequency band of the IC die.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: April 16, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20180301428
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 18, 2018
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 9941228
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: April 10, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • Temperature compensated bulk acoustic wave resonator with a high coupling coefficient
    Patent number: 9929714
    Abstract: The dominant frequency of a solidly mounted resonator (100/280/300/400) is substantially increased by reducing the thickness of each layer of each Bragg acoustic reflector (112/160/224/274) to have a thickness than is substantially equal to one-quarter of the wavelength of a frequency that is a higher harmonic resonant frequency of the fundamental resonant frequency of the solidly mounted resonator (100/280/300/400).
    Type: Grant
    Filed: April 13, 2014
    Date of Patent: March 27, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Stuart M. Jacobsen, Rick L. Wise, Maria Wang, Ricky Alan Jackson, Nicholas S. Dellas, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20170229408
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: April 25, 2017
    Publication date: August 10, 2017
    Inventors: Rajen Manicon MURUGAN, Minhong MI, Gary Paul MORRISON, Jie CHEN, Kenneth Robert RHYNER, Stanley Craig BEDDINGFIELD, Chittranjan Mohan GUPTA, Django Earl TROMBLEY
  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 9666553
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: May 30, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • Rotational transition based clock, rotational spectroscopy cell, and method of making same
    Patent number: 9529334
    Abstract: Described examples include a millimeter wave atomic clock apparatus, chip scale vapor cell, and fabrication method in which a low pressure dipolar molecule gas is provided in a sealed cavity with a conductive interior surface forming a waveguide. Non-conductive apertures provide electromagnetic entrance to, and exit from, the cavity. Conductive coupling structures formed on an outer surface of the vapor cell near the respective non-conductive apertures couple an electromagnetic field to the interior of the cavity for interrogating the vapor cell using a transceiver circuit at a frequency that maximizes the rotational transition absorption of the dipolar molecule gas in the cavity to provide a reference clock signal for atomic clock or other applications.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: December 27, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Juan Alejandro Herbsommer, Benjamin S. Cook, Phillip Nadeau, Simon Joshua Jacobs, Django Earl Trombley
  • ROTATIONAL TRANSITION BASED CLOCK, ROTATIONAL SPECTROSCOPY CELL, AND METHOD OF MAKING SAME
    Publication number: 20160291549
    Abstract: Described examples include a millimeter wave atomic clock apparatus, chip scale vapor cell, and fabrication method in which a low pressure dipolar molecule gas is provided in a sealed cavity with a conductive interior surface forming a waveguide. Non-conductive apertures provide electromagnetic entrance to, and exit from, the cavity. Conductive coupling structures formed on an outer surface of the vapor cell near the respective non-conductive apertures couple an electromagnetic field to the interior of the cavity for interrogating the vapor cell using a transceiver circuit at a frequency that maximizes the rotational transition absorption of the dipolar molecule gas in the cavity to provide a reference clock signal for atomic clock or other applications.
    Type: Application
    Filed: March 31, 2015
    Publication date: October 6, 2016
    Applicant: Texas Instruments Incorporated
    Inventors: Juan Alejandro Herbsommer, Benjamin S. Cook, Phillip Nadeau, Simon Joshua Jacobs, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20150364816
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: June 15, 2015
    Publication date: December 17, 2015
    Inventors: Rajen Manicon MURUGAN, Minhong MI, Gary Paul MORRISON, Jie CHEN, Kenneth Robert RHYNER, Stanley Craig BEDDINGFIELD, Chittranjan Mohan GUPTA, Django Earl TROMBLEY
  • TEMPERATURE COMPENSATED BULK ACOUSTIC WAVE RESONATOR WITH A HIGH COUPLING COEFFICIENT
    Publication number: 20150295556
    Abstract: The dominant frequency of a solidly mounted resonator (100/280/300/400) is substantially increased by reducing the thickness of each layer of each Bragg acoustic reflector (112/160/224/274) to have a thickness than is substantially equal to one-quarter of the wavelength of a frequency that is a higher harmonic resonant frequency of the fundamental resonant frequency of the solidly mounted resonator (100/280/300/400).
    Type: Application
    Filed: April 13, 2014
    Publication date: October 15, 2015
    Applicant: Texas Instrument Incorporated
    Inventors: Stuart M. Jacobsen, Rick L. Wise, Maria Wang, Ricky Alan Jackson, Nicholas S. Dellas, Django Earl Trombley