Abstract: A pigtailed diode laser module is configured with a case housing a plurality of multimode chips which are arranged in at least one row and output respective beams in one direction. Each output beam is collimated in upstream fast and downstream slow axes collimators which are spaced from one another in the one direction. The collimated output beams are incident on respective mirrors redirecting the incident output beams in another direction which is transverse to the one direction. Propagating further one above another, the output beams constitute a combined beam which diverges in the slow axis while propagating towards at least one lens which focuses the combined beam in the slow axis in the focal plane thereof. The output fiber is mounted to the case such that its core end is located coplanar with the smallest cross-section of the focused combined beam spaced downstream from the focal plane at a predetermined distance.

Abstract: A multi-layer laser diode mount is configured with a submount made from thermo- and electro-conductive material. One of the opposite surfaces of the submount supports a laser diode. The other surface of the submount faces and is spaced from a heatsink. The submount and heatsink are configured with respective thermal expansion coefficients (“TEC”) which are different from one another. The opposite surfaces of the submount are electroplated with respective metal layers one of which is bonded to a soft solder layer. In one aspect of the disclosure, the mount is further configured with a spacer having the same TEC as that of the submount and bonded to the soft solder layer. A layer of hard solder bonds the spacer and heatsink to one another. In a further aspect of the disclosure, the electroplated metal layer in contact with the other surface of the submount is hundred- or more micron thick. The soft solder is directly bonded to the heatsink.

Abstract: A multi-layer laser diode mount is configured with a submount made from thermo- and electro-conductive material. One of the opposite surfaces of the submount supports a laser diode. The other surface of the submount faces and is spaced from a heatsink. The submount and heatsink are configured with respective thermal expansion coefficients (“TEC”) which are different from one another. The opposite surfaces of the submount are electroplated with respective metal layers one of which is bonded to a soft solder layer. In one aspect of the disclosure, the mount is further configured with a spacer having the same TEC as that of the submount and bonded to the soft solder layer. A layer of hard solder bonds the spacer and heatsink to one another. In a further aspect of the disclosure, the electroplated metal layer in contact with the other surface of the submount is hundred- or more micron thick. The soft solder is directly bonded to the heatsink.

Abstract: A module is configured with a housing enclosing a diode laser. Fast and slow axes collimators are located behind the rear facet of the laser, which along with a front facet, defines an intra-cavity cavity of the laser. The facets are partially transmissive to light and therefore emit laser light. A wavelength selective optical element is aligned with the collimators and configured to reflect light emitted through the back facet and processed by collimators back into the intra-cavity. As a result, the laser beam is emitted through the front facet at a wavelength locked on the desired wavelength of the optical element. A delivery fiber is mechanically coupled to the front facet of diode laser and configured to receive and guide the emitted laser beam along the path of light.