Abstract: A display substrate includes a base substrate, a gate-line on the base substrate, a data-line crossing the gate-line, a pixel area defined on the base substrate, a gate-pad part connected to an end portion of the gate-line and including a gate corrosion member, and a data-pad part connected to an end portion of the data-line and including a data corrosion member.

Abstract: A display substrate includes a base substrate, a gate-line on the base substrate, a data-line crossing the gate-line, a pixel area defined on the base substrate, a gate-pad part connected to an end portion of the gate-line and including a gate corrosion member, and a data-pad part connected to an end portion of the data-line and including a data corrosion member.

Abstract: A manufacturing method of an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a thin film transistor panel; forming a deposition mask on the thin film transistor panel by a photolithography process; obliquely spraying an organic material to the deposition mask from a linear deposition source to form an organic emission layer on the thin film transistor panel; and removing the deposition mask by using an adhering film, wherein the deposition mask includes a plurality of deposition walls configured to block the organic material sprayed at an angle that is less than a blocking angle. Accordingly, the deposition mask is formed by the photolithography process such that alignment of the deposition mask is straightforward when manufacturing the organic light emitting diode (OLED) display of a large size.

Abstract: A manufacturing method of an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a thin film transistor panel; forming a deposition mask on the thin film transistor panel by a photolithography process; obliquely spraying an organic material to the deposition mask from a linear deposition source to form an organic emission layer on the thin film transistor panel; and removing the deposition mask by using an adhering film, wherein the deposition mask includes a plurality of deposition walls configured to block the organic material sprayed at an angle that is less than a blocking angle. Accordingly, the deposition mask is formed by the photolithography process such that alignment of the deposition mask is straightforward when manufacturing the organic light emitting diode (OLED) display of a large size.

Abstract: An organic light emitting display device includes at least one thin film transistor (TFT) on a substrate, the at least one TFT including a semiconductor active layer, a gate electrode insulated from the semiconductor active layer, and source and drain electrodes contacting the semiconductor active layer, a plurality of first electrodes electrically connected to the at least one TFT, a plurality of banks between the plurality of first electrodes, a plurality of organic layers on respective first electrodes, a plurality of second electrodes on respective organic layers, the second electrodes being separated from each other, and a connection electrode on the plurality of banks and the plurality of second electrodes, the connection electrode being electrically connected to the plurality of the second electrodes.