Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.

Abstract: A connector for a networking cable assembly includes a substrate, a first set of contacts on a first surface of the substrate that electrically connect to leads of a first cable, and a second set of contacts on the first surface of the substrate that electrically connect to leads of a second cable. The first set of contacts are spaced apart from the second set of contacts in a first direction by an amount that enables the second cable to be stacked on the first cable and passed over the first set of contacts to electrically connect to the leads of the second cable.

Abstract: A connector for a networking cable assembly includes a substrate, a first set of contacts on a first surface of the substrate that electrically connect to leads of a first cable, and a second set of contacts on the first surface of the substrate that electrically connect to leads of a second cable. The first set of contacts are spaced apart from the second set of contacts in a first direction by an amount that enables the second cable to be stacked on the first cable and passed over the first set of contacts to electrically connect to the leads of the second cable.

Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.