Abstract: A pump-augmented Loop Heat Pipe (LHP) includes a conventional LHP evaporator/reservoir assembly; one or more additional evaporators; a condenser; a condenser bypass; and a pump upstream of the condenser and condenser bypass and configured to pump fluid generally toward the one or more additional evaporators.

Abstract: An evaporator may include an outer enclosure and a wick within the outer enclosure. The wick may have an outer lateral side surface positioned adjacent to the outer enclosure and may comprise a plurality of circumferential grooves formed in the outer lateral side surface of the wick and a plurality of channels fluidly connected to the plurality of circumferential grooves. The evaporator may include an outer enclosure and an end cap bonded directly to the outer enclosure, contacting the wick, and having a thermal conductivity that is less than the thermal conductivity of the outer enclosure.

Abstract: A heat transfer system includes a first loop and a second loop. The first loop includes a condenser having a vapor inlet and a liquid outlet, a vapor line in fluid communication with the vapor inlet of the condenser, a liquid line in fluid communication with the liquid outlet of the condenser, and primary evaporators fluidly coupled in series with the liquid line and in parallel with the vapor line. The second loop includes a reservoir, a secondary evaporator having a vapor outlet coupled to the vapor line and a fluid inlet coupled to the reservoir, and a sweepage line in fluid communication with the reservoir and the primary evaporators.

Abstract: A heat transfer system includes a first loop and a second loop. The first loop includes a condenser having a vapor inlet and a liquid outlet, a vapor line in fluid communication with the vapor inlet of the condenser, a liquid line in fluid communication with the liquid outlet of the condenser, and primary evaporators fluidly coupled in series with the liquid line and in parallel with the vapor line. The second loop includes a reservoir, a secondary evaporator having a vapor outlet coupled to the vapor line and a fluid inlet coupled to the reservoir, and a sweepage line in fluid communication with the reservoir and the primary evaporators.

Abstract: An evaporator includes an outer fluid enclosure, a liquid inlet port extending through the outer fluid enclosure, a liquid-distribution structure, a wick, and a vapor removal channel. The liquid-distribution structure is joined to the outer fluid enclosure to form a fluidly sealed hermetic chamber. The liquid-distribution structure includes a vapor barrier wall having an outer heat-receiving surface and the liquid-distribution structure is configured to distribute liquid over an inner surface of the vapor barrier wall. The wick is positioned inside the fluidly sealed hermetic chamber and is coupled to a liquid inlet port. The vapor removal channel is defined by and is in fluid communication with the wick and the liquid-distribution structure, and is near the outer heat-receiving surface of the vapor barrier wall. A thermal conductance of the liquid-distribution structure is higher than a thermal conductance of the wick.

Abstract: An evaporator includes a cylindrical barrier wall and a cap that fits at an end of the cylindrical barrier wall. The cylindrical barrier wall defines a central axial opening and an outer cylindrical surface. The cap includes an outer surface that is external to the central axial opening and an inner surface that abuts the central axial opening. A portion of the outer cylindrical surface is configured to define a liquid port extending through the outer cylindrical surface of the cylindrical barrier wall.

Abstract: An evaporator includes a cylindrical barrier wall, and a cap that fits at an end of the cylindrical barrier wall. The cylindrical barrier wall defines a central axial opening and an outer cylindrical surface. The cap includes an outer surface that is external to the central axial opening and an inner surface that abuts the central axial opening. A portion of the outer cylindrical surface is configured to define a liquid port extending through the outer cylindrical surface of the cylindrical barrier wall.

Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Abstract: A LHP/CPL wick includes an unconsolidated wick portion positioned within a first consolidated wick portion and a second consolidated wick portion. This wick provides a large &Dgr;T across the wick, and sufficient capillary action for miniature LHP/CPL applications. Furthermore, the unconsolidated wick portion allows accommodation of mismatched coefficients of thermal expansion. A LHP/CPL having this wick is particularly applicable to silicon cooling devices.

Abstract: A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube having a capillary wick disposed on an internal surface and being mounted within the central recess of the support. Each of the tubes includes a closed distal end and a closed proximal end with a liquid-working fluid entrance port located at the closed proximal end of the first tube and a vaporous-working fluid exit port located at the closed proximal end of the second tube. A duct defining a central passageway and having a capillary wick disposed on the walls of the central passageway is disposed in fluid communication with the first tube and the second tube.

Abstract: A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube having a capillary wick disposed on an internal surface and being mounted within the central recess of the support. Each of the tubes includes a closed distal end and a closed proximal end with a liquid-working fluid entrance port located at the closed proximal end of the first tube and a vaporous-working fluid exit port located at the closed proximal end of the second tube. A duct defining a central passageway and having a capillary wick disposed on the walls of the central passageway is disposed in fluid communication with the first tube and the second tube.

Abstract: An apparatus for maintaining two-phase fluid circulation is disclosed, which includes a two-phase loop containing at least one condenser and at least one evaporator with a capillary structure therein.