Patents by Inventor Dmitry Lubomirsky

Dmitry Lubomirsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240234108
    Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The electrostatic chuck body may define a backside gas lumen that extends through a surface of the substrate seat. The assemblies may include a bias electrode coupled with the electrostatic chuck body. The bias electrode may include a plurality of conductive mesas that protrude upward across the substrate seat. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include at least one chucking electrode embedded within the electrostatic chuck body. The assemblies may include at least one heater embedded within the electrostatic chuck body.
    Type: Application
    Filed: January 4, 2024
    Publication date: July 11, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Paneendra Prakash Bhat, Qiwei Liang, Douglas Buchberger, Dmitry Lubomirsky, Naveen Kumar Nagaraja, Vijay D. Parkhe
  • Publication number: 20240222084
    Abstract: A plasma reactor has a cylindrical microwave cavity overlying a workpiece processing chamber, a microwave source having a pair of microwave source outputs, and a pair of respective waveguides. The cavity has first and second input ports in a sidewall and space apart by an azimuthal angle. Each of the waveguides has a microwave input end coupled to a microwave source output and a microwave output end coupled to a respective one of the first and second input ports, a coupling aperture plate at the output end with a rectangular coupling aperture in the coupling aperture plate, and an iris plate between the coupling aperture plate and the microwave input end with a rectangular iris opening in the iris plate.
    Type: Application
    Filed: March 14, 2024
    Publication date: July 4, 2024
    Inventors: Satoru Kobayashi, Hideo Sugai, Toan Tran, Soonam Park, Dmitry Lubomirsky
  • Patent number: 12009228
    Abstract: A wafer chuck assembly includes a puck, a shaft and a base. The puck includes an electrically insulating material that defines a top surface of the puck; a plurality of electrodes are embedded within the electrically insulating material. The puck also includes an inner puck element that forms one or more channels for a heat exchange fluid, the inner puck element being in thermal communication with the electrically insulating material, and an electrically conductive plate disposed proximate to the inner puck element. The shaft includes an electrically conductive shaft housing that is electrically coupled with the plate, and a plurality of connectors, including electrical connectors for the electrodes. The base includes an electrically conductive base housing that is electrically coupled with the shaft housing, and an electrically insulating terminal block disposed within the base housing, the plurality of connectors passing through the terminal block.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: June 11, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Toan Q. Tran, Zilu Weng, Dmitry Lubomirsky, Satoru Kobayashi, Tae Seung Cho, Soonam Park, Son M. Phi, Shankar Venkataraman
  • Publication number: 20240160117
    Abstract: Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module (100) and includes an upper portion (102) with an electrode (400) and a base portion (104) which is configured to support a substrate (500) on a substrate support surface (159). The upper portion (102) and the base portion (104) are actuated toward and away from one another using one or more arms (112) and form a process volume (404). The process volume (404) is filled with a process fluid and the processing module (100) is rotated about an axis (A). An electric field is applied to the substrate (500) by the electrode (400) before the process fluid is drained from the process volume (404).
    Type: Application
    Filed: April 2, 2021
    Publication date: May 16, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Dmitry LUBOMIRSKY, Kyle M. HANSON, Douglas A. BUCHBERGER, Jr., Alan L. TSO, Rahul KOZHIKKALKANDI, Paul R. MCHUGH, Jiayi SUN, Qiwei LIANG, Nithin Thomas ALEX, Lancelot HUANG, Ellie Y. YIEH
  • Patent number: 11972930
    Abstract: A plasma reactor has a cylindrical microwave cavity overlying a workpiece processing chamber, a microwave source having a pair of microwave source outputs, and a pair of respective waveguides. The cavity has first and second input ports in a sidewall and space apart by an azimuthal angle. Each of the waveguides has a microwave input end coupled to a microwave source output and a microwave output end coupled to a respective one of the first and second input ports, a coupling aperture plate at the output end with a rectangular coupling aperture in the coupling aperture plate, and an iris plate between the coupling aperture plate and the microwave input end with a rectangular iris opening in the iris plate.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: April 30, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Satoru Kobayashi, Hideo Sugai, Toan Tran, Soonam Park, Dmitry Lubomirsky
  • Patent number: 11934103
    Abstract: A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include a transfer device and a plurality of modules. The transfer device is configured to rotate a plurality of substrates between each of the modules, wherein one module includes a heating pedestal and another module includes a cooling pedestal. One module is utilized for inserting and removing the substrates from the system. At least the heating module is able to be sealed and filled with a process volume before applying the electric field.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: March 19, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Douglas A. Buchberger, Jr., Dmitry Lubomirsky, John O. Dukovic, Srinivas D. Nemani
  • Publication number: 20240085810
    Abstract: A method and apparatus for performing post-exposure bake operations is described herein. After exposure of photoresist on a substrate, the substrate is heated during a baking process to facilitate protection of the resist. The baking process is performed in a vacuum environment at sub-atmospheric pressures. After baking at reduced pressure, the substrate is cooled. The cooling process is performed at sub-atmospheric pressures. Further development of the resist is performed at ambient pressures.
    Type: Application
    Filed: September 7, 2023
    Publication date: March 14, 2024
    Inventors: Huixiong DAI, Mangesh Ashok BANGAR, Chih-An HSU, Srinivas D. NEMANI, Dmitry LUBOMIRSKY, Ellie Y. YIEH
  • Patent number: 11915911
    Abstract: An apparatus for distributing plasma products includes first and second electrodes that each include planar surfaces. The first electrode forms first apertures from a first planar surface to a second planar surface; the second electrode forms second apertures from the third planar surface to the fourth planar surface. The electrodes couple through one or more adjustable couplers such that the third planar surface is disposed adjacent to the second planar surface with a gap therebetween, the gap having a gap distance. Each of the adjustable couplers has a range of adjustment. The first and second apertures are arranged such that for at least one position within the ranges of adjustment, none of the first apertures aligns with any of the second apertures to form an open straight-line path extending through both the first and second electrodes.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: February 27, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Tien Fak Tan, Saravjeet Singh, Dmitry Lubomirsky, Tae Wan Kim, Kenneth D. Schatz, Tae Seung Cho, Lok Kee Loh
  • Patent number: 11915950
    Abstract: Exemplary support assemblies may include a top puck and a backing plate coupled with the top puck. The support assemblies may include a cooling plate coupled with the backing plate. The support assemblies may include a heater coupled between the cooling plate and the backing plate. The support assemblies may also include a back plate coupled with the backing plate about an exterior of the backing plate. The back plate may at least partially define a volume, and the heater and the cooling plate may be housed within the volume.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: February 27, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Mehmet Tugrul Samir, Dongqing Yang, Dmitry Lubomirsky, Peter Hillman, Soonam Park, Martin Yue Choy, Lala Zhu
  • Patent number: 11901161
    Abstract: Methods and apparatus for reducing particle generation in a remote plasma source (RPS) include an RPS having a first plasma source with a first electrode and a second electrode, wherein the first electrode and the second electrode are symmetrical with hollow cavities configured to induce a hollow cathode effect within the hollow cavities, and wherein the RPS provides radicals or ions into the processing volume, and a radio frequency (RF) power source configured to provide a symmetrical driving waveform on the first electrode and the second electrode to produce an anodic cycle and a cathodic cycle of the RPS, wherein the anodic cycle and the cathodic cycle operate in a hollow cathode effect mode.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: February 13, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Tae Seung Cho, Saravana Kumar Natarajan, Kenneth D. Schatz, Dmitry Lubomirsky, Samartha Subramanya
  • Patent number: 11834744
    Abstract: Exemplary semiconductor processing chamber showerheads may include a dielectric plate characterized by a first surface and a second surface opposite the first surface. The dielectric plate may define a plurality of apertures through the dielectric plate. The dielectric plate may define a first annular channel in the first surface of the dielectric plate, and the first annular channel may extend about the plurality of apertures. The dielectric plate may define a second annular channel in the first surface of the dielectric plate. The second annular channel may be formed radially outward from the first annular channel. The showerheads may also include a conductive material embedded within the dielectric plate and extending about the plurality of apertures without being exposed by the apertures. The conductive material may be exposed at the second annular channel.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: December 5, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Laksheswar Kalita, Soonam Park, Dmitry Lubomirsky, Tien Fak Tan, LokKee Loh, Saravjeet Singh, Tae Won Kim
  • Patent number: 11815816
    Abstract: A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include an electrode assembly and a base assembly. The electrode assembly includes a permeable electrode. The base assembly includes one or more process fluid channels disposed around a circumference of the substrate support surface and configured to fill a process volume with a process fluid. The electrode assembly is configured to apply an electric field to a substrate disposed within the process volume.
    Type: Grant
    Filed: February 15, 2021
    Date of Patent: November 14, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Douglas A Buchberger, Jr., Dmitry Lubomirsky, John O. Dukovic, Srinivas D. Nemani
  • Patent number: 11735441
    Abstract: Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber. The chamber may include a spacer characterized by a first surface with which the gas box is coupled, and the spacer may define a recessed ledge on an interior portion of the first surface. The chamber may include a support bracket seated on the recessed ledge that extends along a second surface of the spacer. The chamber may also include a gas distribution plate seated on the support bracket.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: August 22, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Tien Fak Tan, Lok Kee Loh, Dmitry Lubomirsky, Soonwook Jung, Martin Yue Choy, Soonam Park
  • Patent number: 11728139
    Abstract: A method and apparatus for substrate etching are described herein. A processing chamber described herein includes a source module, a process module, a flow module, and an exhaust module. An RF source may be coupled to the chamber and a remote plasma may be generated in the source module and a direct plasma may be generated in the process module. Cyclic etching processes described may use alternating radical and direct plasmas to etch a substrate.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: August 15, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Toan Q. Tran, Soonam Park, Junghoon Kim, Dmitry Lubomirsky
  • Patent number: 11715625
    Abstract: Exemplary semiconductor processing systems may include a pedestal configured to support a semiconductor substrate. The pedestal may be operable as a first plasma-generating electrode. The systems may include a lid plate defining a radial volume. The systems may include a faceplate supported with the lid plate. The faceplate may be operable as a second plasma-generating electrode. A plasma processing region may be defined between the pedestal and the faceplate within the radial volume defined by the faceplate. The faceplate may define a plurality of first apertures. The systems may include a showerhead positioned between the faceplate and the pedestal. The showerhead may define a plurality of second apertures comprising a greater number of apertures than the plurality of first apertures.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: August 1, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Greg Toland, Kenneth D. Schatz, Laksheswar Kalita, Dmitry Lubomirsky
  • Publication number: 20230223281
    Abstract: A wafer chuck assembly includes a puck, a shaft and a base. The puck includes an electrically insulating material that defines a top surface of the puck; a plurality of electrodes are embedded within the electrically insulating material. The puck also includes an inner puck element that forms one or more channels for a heat exchange fluid, the inner puck element being in thermal communication with the electrically insulating material, and an electrically conductive plate disposed proximate to the inner puck element. The shaft includes an electrically conductive shaft housing that is electrically coupled with the plate, and a plurality of connectors, including electrical connectors for the electrodes. The base includes an electrically conductive base housing that is electrically coupled with the shaft housing, and an electrically insulating terminal block disposed within the base housing, the plurality of connectors passing through the terminal block.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 13, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Toan Q. Tran, Zilu Weng, Dmitry Lubomirsky, Satoru Kobayashi, Tae Seung Cho, Soonam Park, Son M. Phi, Shankar Venkataraman
  • Publication number: 20230203657
    Abstract: Exemplary semiconductor processing chamber showerheads may include a dielectric plate characterized by a first surface and a second surface opposite the first surface. The dielectric plate may define a plurality of apertures through the dielectric plate. The dielectric plate may define a first annular channel in the first surface of the dielectric plate, and the first annular channel may extend about the plurality of apertures. The dielectric plate may define a second annular channel in the first surface of the dielectric plate. The second annular channel may be formed radially outward from the first annular channel. The showerheads may also include a conductive material embedded within the dielectric plate and extending about the plurality of apertures without being exposed by the apertures. The conductive material may be exposed at the second annular channel.
    Type: Application
    Filed: February 23, 2023
    Publication date: June 29, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Laksheswar Kalita, Soonam Park, Dmitry Lubomirsky, Tien Fak Tan, LokKee Loh, Saravjeet Singh, Tae Won Kim
  • Publication number: 20230161260
    Abstract: A method and apparatus for performing post-exposure bake cooling operations is described herein. The method begins by post exposure baking a substrate disposed on heated substrate support in a process chamber, the process chamber having a showerhead. The heated substrate support is moved to increase a distance between the heated substrate support and a cooled plate of the showerhead. The substrate is separated from the heated substrate support using a substrate lifting device. The substrate is moved into a close proximity to the cooled showerhead. The substrate is cooled until the substrate is less than about 70 degrees Celsius. The substrate is spaced away from the cooled showerhead using the substrate lifting device and aligning the substrate with a substrate transfer passage of the processing chamber for removal by a robot.
    Type: Application
    Filed: October 5, 2022
    Publication date: May 25, 2023
    Inventors: Dmitry LUBOMIRSKY, Douglas A. BUCHBERGER, Jr., Hyunjun KIM, Alan L. TSO, Shekhar ATHANI, Qiwei LIANG, Ellie Y. YIEH
  • Publication number: 20230125435
    Abstract: An ion extraction assembly for an ion source is provided. The ion extraction assembly may include a plurality of electrodes, wherein the plurality of electrodes comprises: a plasma-facing electrode, arranged for coupling to a plasma chamber; and a substrate-facing electrode, disposed outside of the plasma-facing electrode. The at least one electrode of the plurality of electrodes may include a grid structure, defining a plurality of holes, wherein the at least one electrode has a non-uniform thickness, wherein a first grid thickness in a middle region of the at least one electrode is different than a second grid thickness, in an outer region of the at least one electrode.
    Type: Application
    Filed: October 27, 2021
    Publication date: April 27, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Alexandre Likhanskii, Alan V. Hayes, Dmitry Lubomirsky
  • Patent number: 11637002
    Abstract: A semiconductor processing chamber may include a remote plasma region, and a processing region fluidly coupled with the remote plasma region. The processing region may be configured to house a substrate on a support pedestal. The support pedestal may include a first material at an interior region of the pedestal. The support pedestal may also include an annular member coupled with a distal portion of the pedestal or at an exterior region of the pedestal. The annular member may include a second material different from the first material.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: April 25, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Saravjeet Singh, Alan Tso, Jingchun Zhang, Zihui Li, Hanshen Zhang, Dmitry Lubomirsky