Patents by Inventor Dmitry V. Bakin

Dmitry V. Bakin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7042581
    Abstract: A characteristic of a surface is measured by illuminating the surface with optical radiation over a wide angle and receiving radiation reflected from the surface over an angle that depends on the extend of the illumination angle. An emissivity measurement is made for the surface, and, alternatively, if a reflectivity measurement is made, it becomes more accurate. One application is to measure the thickness of a layer or layers, either a layer made of transparent material or a metal layer. A one or multiple wavelength technique allow very precise measurements of layer thickness. Noise from ambient radiation is minimized by modulating the radiation source at a frequency where such noise is a minimum or non-existent. The measurements may be made during processing of the surface in order to allow precise control of processing semiconductor wafers, flat panel displays, or other articles. A principal application is in situ monitoring of film thickness reduction by chemical-mechanical-polishing (CMP).
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: May 9, 2006
    Assignee: Luxtron Corporation
    Inventors: Charles W. Schietinger, Anh N. Hoang, Dmitry V. Bakin
  • Patent number: 7027232
    Abstract: In the beam path of an Optical Cross Connect between the front face of a fiber block and a moveable mirror array are placed a telecentric lens and multi-surface optical element. The lens is placed adjacent the front face with a front focal plane coinciding with the front face. The substantially parallel beam path axes between the front face and the telecentric lens are converted by the lens into dispersing directions towards the optical element. Discrete optical surfaces of the optical element redirect the dispersing beam paths in a fashion such that the beam paths coincide in the following with corresponding moveable mirrors of a mirror array. Pitches of arrayed fiber ends and of the optical surfaces as well as the moveable mirrors are independently selectable. The telecentric lens simultaneously focuses the signal beams with improved beam separation and reduced signal loss.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: April 11, 2006
    Assignee: Intel Corporation
    Inventors: Dmitry V. Bakin, Cheng-Chung Huang
  • Patent number: 6985299
    Abstract: In the beam path of an Optical Cross Connect between the front face of a fiber block and a moveable mirror array are placed a telecentric lens and multi-surface optical element. The lens is placed adjacent the front face with a front focal plane coinciding with the front face. The substantially parallel beam path axes between the front face and the telecentric lens are converted by the lens into dispersing directions towards the optical element. Discrete optical surfaces of the optical element redirect the dispersing beam paths in a fashion such that the beam paths coincide in the following with corresponding moveable mirrors of a mirror array. Pitches of arrayed fiber ends and of the optical surfaces as well as the moveable mirrors are independently selectable. The telecentric lens simultaneously focuses the signal beams with improved beam separation and reduced signal loss.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: January 10, 2006
    Assignee: Intel Corporation
    Inventors: Dmitry V. Bakin, Cheng-Chung Huang
  • Patent number: 6934040
    Abstract: A characteristic of a surface is measured by illuminating the surface with optical radiation over a wide angle and receiving radiation reflected from the surface over an angle that depends on the extend of the illumination angle. An emissivity measurement is made for the surface, and, alternatively, if a reflectivity measurement is made, it becomes more accurate. One application is to measure the thickness of a layer or layers, either a layer made of transparent material or a metal layer. A one or multiple wavelength technique allow very precise measurements of layer thickness. Noise from ambient radiation is minimized by modulating the radiation source at a frequency where such noise is a minimum or non-existent. The measurements may be made during processing of the surface in order to allow precise control of processing semiconductor wafers, flat panel displays, or other articles. A principal application is in situ monitoring of film thickness reduction by chemical-mechanical-polishing (CMP).
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: August 23, 2005
    Assignee: Luxtron Corporation
    Inventors: Charles W. Schietinger, Anh N. Hoang, Dmitry V. Bakin
  • Publication number: 20040145817
    Abstract: In the beam path of an Optical Cross Connect between the front face of a fiber block and a moveable mirror array are placed a telecentric lens and multi-surface optical element. The lens is placed adjacent the front face with a front focal plane coinciding with the front face. The substantially parallel beam path axes between the front face and the telecentric lens are converted by the lens into dispersing directions towards the optical element. Discrete optical surfaces of the optical element redirect the dispersing beam paths in a fashion such that the beam paths coincide in the following with corresponding moveable mirrors of a mirror array. Pitches of arrayed fiber ends and of the optical surfaces as well as the moveable mirrors are independently selectable. The telecentric lens simultaneously focuses the signal beams with improved beam separation and reduced signal loss.
    Type: Application
    Filed: January 29, 2003
    Publication date: July 29, 2004
    Inventors: Dmitry V. Bakin, Cheng-Chung Huang
  • Patent number: 6654132
    Abstract: A characteristic of a surface is measured by illuminating the surface with optical radiation over a wide angle and receiving radiation reflected from the surface over an angle that depends on the extend of the illumination angle. An emissivity measurement is made for the surface, and, alternatively, if a reflectivity measurement is made, it becomes more accurate. One application is to measure the thickness of a layer or layers, either a layer made of transparent material or a metal layer. A one or multiple wavelength technique allow very precise measurements of layer thickness. Noise from ambient radiation is minimized by modulating the radiation source at a frequency where such noise is a minimum or non-existent. The measurements may be made during processing of the surface in order to allow precise control of processing semiconductor wafers, flat panel displays, or other articles. A principal application is in situ monitoring of film thickness reduction by chemical-mechanical-polishing (CMP).
    Type: Grant
    Filed: May 24, 2000
    Date of Patent: November 25, 2003
    Assignee: Luxtron Corporation
    Inventors: Charles W. Schietinger, Anh N. Hoang, Dmitry V. Bakin
  • Patent number: 6222632
    Abstract: An instrument for determining spectral content of an input light. The instrument has a rotating optical element that separates an input light into two partial beams and thereby introduces a variable OPD between the partial beams. The instrument then records an interferogram as a function of the variable OPD and thereby Fourier or Fast Fourier transforms the interferogram into a spectrogram so that the spectral content of the input light is revealed.
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: April 24, 2001
    Assignee: Luxtron Corporation
    Inventor: Dmitry V. Bakin