Patents by Inventor Dnyanesh Tamboli

Dnyanesh Tamboli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Post Chemical Mechanical Planarization (CMP) Cleaning
    Publication number: 20240026246
    Abstract: The present invention provides a cleaning composition comprises water; one or more organic acid; at least two surfactants wherein the first type surfactant is a diphenyl disulfonic surfactant, the second type surfactant has a surface tension of less than 50 dynes/cm at 0.01 wt % concentration in water, and the second type surfactant is not the first type surfactant; and optionally fluoride compounds, polymers, corrosion inhibitors, biological preservatives, pH adjusting agents.
    Type: Application
    Filed: August 26, 2021
    Publication date: January 25, 2024
    Inventors: Dnyanesh Tamboli, HEE MING HWANG, JEONG YUN YU
  • Composition and method used for chemical mechanical planarization of metals
    Publication number: 20080254629
    Abstract: Compositions for use in CMP processing and methods of CMP processing. The composition utilizes low levels of particulate material, in combination with at least one amino acid, at least one oxidizer, and water to remove a metal layer such as one containing copper to a stop layer with high selectivity.
    Type: Application
    Filed: June 16, 2008
    Publication date: October 16, 2008
    Inventors: Song Y. Chang, Mark Evans, Dnyanesh Tamboli, Stephen W. Hymes
  • Alkaline post-chemical mechanical planarization cleaning compositions
    Publication number: 20050205835
    Abstract: A post-CMP cleaning composition and method comprising same are disclosed herein. In one aspect, there is provided a composition comprising: water, an organic base, and a plurality of chelating agents comprised of a poly-amino carboxylic acid and a hydroxylcarboxylic acid wherein the pH of the composition ranges from 9.5 to 11.5.
    Type: Application
    Filed: February 25, 2005
    Publication date: September 22, 2005
    Inventors: Dnyanesh Tamboli, Gautam Banerjee
  • Composition and method used for chemical mechanical planarization of metals
    Publication number: 20040175942
    Abstract: Compositions for use in CMP processing and methods of CMP processing. The composition utilizes low levels of particulate material, in combination with at least one amino acid, at least one oxidizer, and water to remove a metal layer such as one containing copper to a stop layer with high selectivity.
    Type: Application
    Filed: December 23, 2003
    Publication date: September 9, 2004
    Inventors: Song Y. Chang, Mark Evans, Dnyanesh Tamboli, Stephen W. Hymes