Patents by Inventor Do Bum Shin

Do Bum Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5930665
    Abstract: A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: July 27, 1999
    Assignee: ITT Industries, Inc.
    Inventors: Ching-Fai Cho, Helmut Carl Maiershofer, Do Bum Shin, Avery Yee Quil
  • Patent number: 5757252
    Abstract: A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.
    Type: Grant
    Filed: June 11, 1996
    Date of Patent: May 26, 1998
    Assignee: ITT Industries, Inc.
    Inventors: Ching-Fai Cho, Helmut Carl Maiershofer, Do Bum Shin, Avery Yee Quil