Patents by Inventor Do-Chul Shin

Do-Chul Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072140
    Abstract: A semiconductor device includes, first and second source/drain patterns on an active pattern and spaced apart from each other, a first source/drain contact on the first source/drain pattern and including a first source/drain barrier film and a first source/drain filling film on the first source/drain barrier film, a second source/drain contact on the second source/drain pattern, and a gate structure on the active pattern between the first and second source/drain contacts and including a gate electrode, wherein a top surface of the first source/drain contact is lower than a top surface of the gate structure, and a height from a top surface of the active pattern to a top surface of the first source/drain barrier film is less than a height from the top surface of the active pattern to a top surface of the first source/drain filling film.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: Won Hyuk Lee, Jong Chul Park, Sang Duk Park, Hong Sik Shin, Do Haing Lee
  • Publication number: 20240074065
    Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.
    Type: Application
    Filed: February 17, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Jae YOO, Yong Gil NAMGUNG, Jong Hoon SHIN, Sang Soon CHOI, Young Chul AN
  • Patent number: 6869476
    Abstract: Disclosed herein is a waterproof admixture composition for concrete which is added to fabricate concrete having excellent anti-corrosive performance. The waterproof admixture composition can protect reinforcing steel bars against oxidation in the presence of salt, thereby ensuring excellent anti-corrosive performance and thus greatly improving the durability of reinforced concrete even in salt-damaged areas and corrosive environments and the like by inhibiting the corrosion of the reinforced concrete. The waterproof admixture composition comprises fly ash and silica fume as artificial pozzolan activators, a redispersible powders resin, a higher fatty acid-based metal salt and a high performance water-reducing agent wherein the composition further comprises 18 to 34% by weight of an inorganic salt and 1 to 5% by weight of tannin as an antioxidant, based on the total weight of the composition.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: March 22, 2005
    Assignee: Jang San Waterproof Industrial Co., Ltd.
    Inventors: Do-Chul Shin, Won-Hwa Kim
  • Publication number: 20040103814
    Abstract: Disclosed herein is a waterproof admixture composition for concrete which is added to fabricate concrete having excellent anti-corrosive performance. The waterproof admixture composition can protect reinforcing steel bars against oxidation in the presence of salt, thereby ensuring excellent anti-corrosive performance and thus greatly improving the durability of reinforced concrete even in salt-damaged areas and corrosive environments and the like by inhibiting the corrosion of the reinforced concrete. The waterproof admixture composition comprises fly ash and silica fume as artificial pozzolan activators, a redispersible powders resin, a higher fatty acid-based metal salt and a high performance water-reducing agent wherein the composition further comprises 18 to 34% by weight of an inorganic salt and 1 to 5% by weight of tannin as an antioxidant, based on the total weight of the composition.
    Type: Application
    Filed: November 25, 2003
    Publication date: June 3, 2004
    Inventors: Do-Chul Shin, Won-Hwa Kim