Patents by Inventor Do Eok KIM

Do Eok KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250243406
    Abstract: A quantum dot preparing method according to an embodiment of the present invention comprises the steps of: preparing a first solution containing at least one first cation precursor and a second solution containing at least one first anion precursor; mixing the first solution and the second solution at 20° C. to 130° C. to prepare a first mixture; raising the temperature of the first mixture to a high temperature of 300° C. within 1 minute; and cooling the first mixture, of which the temperature is raised, to 100° C. or lower within 1 minute, thereby forming a core, wherein the first cation precursor includes an indium oxo cluster (In-Oxocluster).
    Type: Application
    Filed: May 13, 2022
    Publication date: July 31, 2025
    Inventors: Han Il CHUNG, Hae Sik KIM, Do Eok KIM, Jeong Hwan YU, Jae Wook LEE
  • Patent number: 10429033
    Abstract: A quantum dot sheet includes quantum dots, light scattering agents and a resin, where the resin includes repeated units represented by the chemical formula using an aryl group of C6-C30, and a substituted or unsubstituted alkyl group of C1-C1000.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: October 1, 2019
    Assignee: HEESUNG ELECTRONICS CO., LTD.
    Inventors: Na Rae Yoon, Hyun Seok Cho, Do Eok Kim
  • Publication number: 20170138567
    Abstract: The present disclosure relates to a quantum dot, a resin, a quantum dot sheet, and a back light unit using the same, and more particularly, to a quantum dot including an inorganic ion ligand, a resin with excellent property of blocking oxygen and moisture, a quantum dot sheet with improved light conversion efficiency, and a back light unit including the same. The quantum dot of the present disclosure includes a core including a semiconductor material; and inorganic ion ligands covering the surface of the core, in which the inorganic ion ligand includes element of a halogen group or chalcogen group.
    Type: Application
    Filed: December 14, 2015
    Publication date: May 18, 2017
    Inventors: Na Rae YOON, Hyun Seok CHO, Do Eok KIM