Abstract: Disclosed is a method of removing a photoresist pattern, which includes radiating light onto a substrate having a photoresist pattern formed thereon and implanted with a predetermined dopant so that the temperature of the substrate is increased to be equal to or higher than a temperature able to remove the photoresist pattern, and by which the photoresist pattern formed on the substrate can be almost completely removed using a simple process for radiating light onto the substrate so that the temperature of the substrate is increased to be equal to or higher than a temperature able to the photoresist pattern.

Abstract: Disclosed is a method of removing a photoresist pattern, which includes radiating light onto a substrate having a photoresist pattern formed thereon and implanted with a predetermined dopant so that the temperature of the substrate is increased to be equal to or higher than a temperature able to remove the photoresist pattern, and by which the photoresist pattern formed on the substrate can be almost completely removed using a simple process for radiating light onto the substrate so that the temperature of the substrate is increased to be equal to or higher than a temperature able to the photoresist pattern.

Abstract: A method of forming an integrated circuit device includes the steps of forming a conductive pattern on an integrated circuit device, and forming an insulating layer on the conductive pattern and on the integrated circuit substrate. An upper surface portion of the insulating layer opposite the substrate is removed, and a photoresist layer is formed on the insulating layer after the step of removing the upper surface portion. The photoresist layer is patterned, and exposed portions of the insulating layer are etched using the patterned photoresist layer as an etching mask thereby forming contact holes through the insulating layer.