Patents by Inventor Do-hoon Chang
Do-hoon Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9994704Abstract: A thermoplastic elastomer composition of the present invention comprises (A) 30 to 40% by weight of a block terpolymer of an aromatic vinyl compound and alkene or a conjugated diene-based compound; (B) 25 to 50% by weight of a paraffin oil; (C) 1 to 5% by weight of a polyolefin-based resin; (D) 5 to 20% by weight of an inorganic additive; and (E) 5 to 15% by weight of a polyphenylene ether-based resin. The thermoplastic elastomer composition, which has a surface hardness of 0.1 to 40 A (shore A), shows excellent low hardness and has improved physical properties at high temperature, particularly, flexibility, restoring force at high temperatures, and the like.Type: GrantFiled: December 14, 2012Date of Patent: June 12, 2018Assignee: Lotte Advanced Materials Co., Ltd.Inventors: Jung Wook Kim, Do Hoon Chang, Chang Min Hong
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Patent number: 9321904Abstract: A polyamide resin composition includes (A) a semi-aromatic polyamide resin including a dicarboxylic acid unit including about 40 to about 100 mol % of an aromatic dicarboxylic acid unit, and an aliphatic diamine unit; (B) a glass fiber, and optionally (C) a heat stabilizer including copper halide and/or alkali metal halide, where a content of a terminal carboxyl group [COOH] and a content of a terminal amino group [NH2] of a molecular chain in the semi-aromatic polyamide resin (A) satisfy the following conditions: [COOH]>37 ?eq/g; [NH2]>80 ?eq/g; and, [NH2]/[COOH]>1.Type: GrantFiled: December 20, 2013Date of Patent: April 26, 2016Assignee: Cheil Industries Inc.Inventors: Jae-Youp Chung, Jung-Hun Lee, Do-Hoon Chang, Chang-Min Hong
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Patent number: 9074094Abstract: A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin.Type: GrantFiled: December 30, 2013Date of Patent: July 7, 2015Assignee: Cheil Industries Inc.Inventors: Doo-Young Kim, Jung-Hun Lee, Jin-Kyung Cho, Do-Hoon Chang, Chang-Min Hong
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Publication number: 20140309353Abstract: A thermoplastic elastomer composition of the present invention comprises (A) 30 to 40% by weight of a block terpolymer of an aromatic vinyl compound and alkene or a conjugated diene-based compound; (B) 25 to 50% by weight of a paraffin oil; (C) 1 to 5% by weight of a polyolefin-based resin; (D) 5 to 20% by weight of an inorganic additive; and (E) 5 to 15% by weight of a polyphenylene ether-based resin. The thermoplastic elastomer composition, which has a surface hardness of 0.1 to 40 A (shore A), shows excellent low hardness and has improved physical properties at high temperature, particularly, flexibility, restoring force at high temperatures, and the like.Type: ApplicationFiled: December 14, 2012Publication date: October 16, 2014Applicant: Cheil Industries Inc.Inventors: Jung Wook Kim, Do Hoon Chang, Chang Min Hong
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Publication number: 20140187703Abstract: A polyamide resin composition includes (A) a semi-aromatic polyamide resin including a dicarboxylic acid unit including about 40 to about 100 mol % of an aromatic dicarboxylic acid unit, and an aliphatic diamine unit; (B) a glass fiber, and optionally (C) a heat stabilizer including copper halide and/or alkali metal halide, where a content of a terminal carboxyl group [COOH] and a content of a terminal amino group [NH2] of a molecular chain in the semi-aromatic polyamide resin (A) satisfy the following conditions: [COOH]>37 ?eq/g; [NH2]>80 ?eq/g; and, [NH2]/[COOH]>1.Type: ApplicationFiled: December 20, 2013Publication date: July 3, 2014Applicant: Cheil Industries Inc.Inventors: Jae-Youp CHUNG, Jung-Hun LEE, Do-Hoon CHANG, Chang-Min HONG
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Publication number: 20140187686Abstract: A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin.Type: ApplicationFiled: December 30, 2013Publication date: July 3, 2014Applicant: Cheil Industries Inc.Inventors: Doo-Young KIM, Jung-Hun LEE, Jin-Kyung CHO, Do-Hoon CHANG, Chang-Min HONG
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Publication number: 20130231437Abstract: The present invention relates to a thermoplastic resin composition, comprising: a base resin comprising (A) a polyphenylene ether resin and (B) an aromatic vinyl-based resin, and (C) glass fibers, wherein the (C) glass fibers include (C1) chopped glass fibers and (C2) milled glass fibers.Type: ApplicationFiled: April 19, 2013Publication date: September 5, 2013Applicant: Cheil Industries Inc.Inventors: Jin Kyung CHO, Do Hoon CHANG, Jin Young HUH, Ywan Hee LEE, Doo Han HA
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Publication number: 20120172515Abstract: Polyphenylene ether thermoplastic resin compositions are formed by adding a polyamide resin to a composition of a polyphenylene ether resin and a polystyrene resin. The composition can have improved heat deflection temperature while maintaining fluidity of polyphenylene ether.Type: ApplicationFiled: November 21, 2011Publication date: July 5, 2012Applicant: CHEIL INDUSTRIES INC.Inventors: Jin Kyung CHO, Do Hoon CHANG, Doo Han HA, Ywan Hee LEE, Jin Young HUH
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Publication number: 20090036587Abstract: Disclosed is a polypropylene resin composition with flame retardance and abrasion resistance. The polypropylene resin composition according to the present invention includes 20 to 200 parts by weight of an inorganic flame retardant; and 0.1 to 10 parts by weight of at least one additive, based on 100 parts by weight of a base resin comprising 30 to 90% by weight of polypropylene copolymer resin and 10 to 70% by weight of polyolefin alpha copolymer resin. The polypropylene resin composition according to the present invention can be used for industrial cables with potent endurance since it includes an inorganic flame retardant to show flame retardance and it can remove or reduce a whitening phenomenon and show a significantly improved abrasion resistance without deteriorating moldability or mechanical property even when the contents of the composition are varied to enhance abrasion resistance.Type: ApplicationFiled: February 16, 2007Publication date: February 5, 2009Applicant: LS CABLE LTD.Inventors: Do-Hoon Chang, June-Sun Kim, In-Hwoi Lee, Gun-Ju Lee, In-Ha Kim, Sun-Keun Kim
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Publication number: 20070078211Abstract: Disclosed is a resin composition for improving a whitening resistance in bending deformation. The flame retardant polypropylene-based resin composition with an improved whitening resistance in bending deformation according to the present invention includes a polypropylene-based resin, a polyolefin elastomer, a modified polyolefin elastomer grafted with polar groups and an inorganic flame retardant, wherein the polypropylene-based resin is included at a content of 5 to 50 % by weight of the total composition, wherein the polyolefin elastomer is included at a content of 0.1 to 50 % by weight of the total composition, wherein the modified polyolefin elastomer grafted with polar groups is included at a content of 0.1 to 30 % by weight of the total composition, and wherein the inorganic flame retardant is included at a content of 30 to 75 % by weight of the total composition.Type: ApplicationFiled: September 22, 2006Publication date: April 5, 2007Inventors: Do-Hoon Chang, Sun-Hyuk Bae, June-Sun Kim, Gun-Joo Lee
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Patent number: 7147893Abstract: A disc is produced using a method of and an apparatus for forming a transparent layer on a disc substrate. The method for forming the transparent layer on the disc substrate includes covering an axial hole formed at a center of the disc substrate with a cover element by inserting a protrusion of the cover element in the axial hole of the disc substrate so that a resin does not leak through the axial hole, dispensing the resin toward the center of the disc substrate from an upper side of the disc substrate, and removing the cover element. A more uniform transparent layer can be obtained throughout the disc substrate.Type: GrantFiled: August 14, 2002Date of Patent: December 12, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Do-hoon Chang, Myong-do Ro, Du-seop Yoon, Chang-min Park
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Patent number: 7041333Abstract: A method of manufacturing an optical disc includes easily removing a bump formed on a circumference of the optical disc during forming a transparent layer by using a spin-coating method to form the optical disk having a high-density recording capacity. The method includes preparing a substrate having a diameter larger than that of a desired disc, applying an ultraviolet hardening resin to the substrate and forming a transparent layer having a predetermined thickness by a spin-coating method, illuminating an ultraviolet ray on the transparent layer and a bump formed on a circumference of the transparent layer to be hardened, and cutting out the bump by using a puncher. According to the method, the bump which inevitably occurs when the transparent layer is formed, can be easily cut out by a puncher.Type: GrantFiled: July 5, 2002Date of Patent: May 9, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Do-hoon Chang, Jin-hwan Kim, Myong-do Ro, Du-seop Yoon
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Patent number: 7008975Abstract: A light-curable resin composition includes an acrylate oligomer, an acrylate monomer having 4 or less functional groups, a photopolymerization initiator, a hardness enhancing agent represented by the formula(1), m-terphenyl represented by the formula(2) and a colloidal antistatic agent. The light-curable resin composition has a high antistatic property and a light transmittance, as well as a high hardness and a low shrinkage rate.Type: GrantFiled: September 29, 2004Date of Patent: March 7, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Do-hoon Chang, Myong-do Ro, Du-seop Yoon, In-sik Park
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Publication number: 20050043427Abstract: A light-curable resin composition includes an acrylate oligomer, an acrylate monomer having 4 or less functional groups, a photopolymerization initiator, a hardness enhancing agent represented by the formula(1), m-terphenyl represented by the formula(2) and a colloidal antistatic agent. The light-curable resin composition has a high antistatic property and a light transmittance, as well as a high hardness and a low shrinkage rate.Type: ApplicationFiled: September 29, 2004Publication date: February 24, 2005Applicant: Samsung Electronics Co., Ltd.Inventors: Do-hoon Chang, Myong-do Ro, Du-seop Yoon, In-sik Park
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Patent number: 6815034Abstract: A light-curable resin composition includes an acrylate oligomer, an acrylate monomer having 4 or less functional groups, a photopolymerization initiator, a hardness enhancing agent represented by the formula(1), m-terphenyl represented by the formula(2) and a colloidal antistatic agent. The light-curable resin composition has a high antistatic property and a light transmittance, as well as a high hardness and a low shrinkage rate.Type: GrantFiled: December 12, 2002Date of Patent: November 9, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Do-hoon Chang, Myong-do Ro, Du-seop Yoon, In-sik Park
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Publication number: 20030199601Abstract: A light-curable resin composition includes an acrylate oligomer, an acrylate monomer having 4 or less functional groups, a photopolymerization initiator, a hardness enhancing agent represented by the formula(1), m-terphenyl represented by the formula(2) and a colloidal antistatic agent. The light-curable resin composition has a high antistatic property and a light transmittance, as well as a high hardness and a low shrinkage rate.Type: ApplicationFiled: December 12, 2002Publication date: October 23, 2003Applicant: Samsung Electronics Co., Ltd.Inventors: Do-hoon Chang, Myong-do Ro, Du-seop Yoon, In-sik Park
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Publication number: 20030054098Abstract: An apparatus and method to manufacture a disc include a spindle table, a spin coating portion coating a resin onto a disc substrate mounted on the spindle table, and a resin hardening portion hardening the resin, which is coated onto the disc substrate, where the disc substrate is mounted on the spindle table.Type: ApplicationFiled: August 21, 2002Publication date: March 20, 2003Applicant: Samsung Electronics Co., Ltd.Inventors: Do-Hoon Chang, In-sik Park, Myong-do Ro, Du-seop Yoon
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Publication number: 20030039797Abstract: A disc is produced using a method of and an apparatus for forming a transparent layer on a disc substrate. The method for forming the transparent layer on the disc substrate includes covering an axial hole formed at a center of the disc substrate with a cover element by inserting a protrusion of the cover element in the axial hole of the disc substrate so that a resin does not leak through the axial hole, dispensing the resin toward the center of the disc substrate from an upper side of the disc substrate, and removing the cover element. A more uniform transparent layer can be obtained throughout the disc substrate.Type: ApplicationFiled: August 14, 2002Publication date: February 27, 2003Applicant: Samsung Electronics Co., Ltd.Inventors: Do-hoon Chang, Myong-do Ro, Du-seop Yoon, Chang-min Park
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Publication number: 20030021888Abstract: A method of manufacturing an optical disc includes easily removing a bump formed on a circumference of the optical disc during forming a transparent layer by using a spin-coating method to form the optical disk having a high-density recording capacity. The method includes preparing a substrate having a diameter larger than that of a desired disc, applying an ultraviolet hardening resin to the substrate and forming a transparent layer having a predetermined thickness by a spin-coating method, illuminating an ultraviolet ray on the transparent layer and a bump formed on a circumference of the transparent layer to be hardened, and cutting out the bump by using a puncher. According to the method, the bump which inevitably occurs when the transparent layer is formed, can be easily cut out by a puncher.Type: ApplicationFiled: July 5, 2002Publication date: January 30, 2003Applicant: Samsung Electronics Co. Ltd.Inventors: Do-hoon Chang, Jin-hwan Kim, Myong-do Ro, Du-seop Yoon