Patents by Inventor Do Hyun BYUN

Do Hyun BYUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicyclopentadiene-based resin, dicyclopentadiene-based hydrogenated resin, and adhesive resin composition comprising same
    Patent number: 11866534
    Abstract: The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: January 9, 2024
    Assignee: HANWHA SOLUTIONS CORPORATION
    Inventors: Hyeonuk Kang, Do Hyun Byun, Kyongjun Yoon
  • RESIN COMPOSITION FOR TACKIFIER OR ADHESIVE AND PREPARATION METHOD THEREOF
    Publication number: 20220356379
    Abstract: Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.
    Type: Application
    Filed: March 19, 2020
    Publication date: November 10, 2022
    Inventors: Hyeon Uk KANG, Do Hyun BYUN, Ying ZHANG, Pilje SEONG
  • DICYCLOPENTADIENE-BASED RESIN, DICYCLOPENTADIENE-BASED HYDROGENATED RESIN, AND ADHESIVE RESIN COMPOSITION COMPRISING SAME
    Publication number: 20220025094
    Abstract: The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.
    Type: Application
    Filed: October 31, 2019
    Publication date: January 27, 2022
    Inventors: Hyeonuk KANG, Do Hyun BYUN, Kyongjun YOON