Patents by Inventor Do Hyun Kim

Do Hyun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11564793
    Abstract: The present disclosure relates to a method for manufacturing nose implant, including obtaining a 3-dimensional image of a nasal bone and a 3-dimensional image of a nasal cavity; modeling a nasal cartilage by applying information of anatomy between the nasal bone, nasal cavity, and nasal cartilage, to the 3-dimensional image of the nasal bone and the 3-dimensional image of the nasal cavity; and modeling an inner shape of where the implant may be seated, from the 3-dimensional image of the nasal bone and the modelled nasal cartilage.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: January 31, 2023
    Assignees: ANYMEDI INC.
    Inventors: Jung Hwan Baek, Guk Bae Kim, Seung Hyun Choi, Yun Jung Choi, Do Yun Lee
  • Publication number: 20230029017
    Abstract: A multilayer adhesive sheet, an optical member including the same, and a display apparatus including the same are provided. A multilayer adhesive sheet includes: a base layer; a first adhesive layer stacked on a surface of the base layer; and a second adhesive layer stacked on another surface of the base layer, and the base layer includes a polyurethane-based film manufactured by solution casting and has a storage modulus of 700 MPa to 1,500 MPa at ?20° C. and a storage modulus of 10 MPa to 100 MPa at 85° C.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 26, 2023
    Inventors: Dong Myeong SHIN, Gwang Hwan LEE, Sung Hyun MUN, Il Jin KIM, Do Young KIM
  • Publication number: 20230012532
    Abstract: A cleaning apparatus including a vacuum cleaner and a docking station is provided. The cleaning apparatus includes a vacuum cleaner including a dust collecting chamber in which foreign substances are collected, and a docking station configured to be connected to the dust collecting chamber to remove the foreign substances collected in the dust collecting chamber. The dust collecting chamber is configured to collect foreign substances through centrifugation, and configured to be docked to the docking station, and the docking station includes a suction device configured to suction the foreign substances and air in the dust collecting chamber docked to the docking station.
    Type: Application
    Filed: August 19, 2022
    Publication date: January 19, 2023
    Inventors: See Hyun KIM, In Gyu CHOI, Ki Hwan KWON, Shin KIM, Hyeon Cheol KIM, Do Kyung LEE, Hyun Ju LEE, Yun Soo JANG, Seung Ryong CHA, Jung Gyun HAN
  • Publication number: 20230018645
    Abstract: Proposed are a seat side bolster apparatus and a control method thereof. The seat side bolster apparatus of the disclosure includes a driving unit, which is provided under a foam pad of a seat cushion, is moved upwards and downwards by operation of an actuator, and presses the foam pad upwards when moving upwards, and a covering bracket, which is connected to the driving unit so as to be moved upwards and downwards together with the driving unit and to which an end of a covering enveloping the foam pad of the seat cushion is fixed.
    Type: Application
    Filed: July 13, 2022
    Publication date: January 19, 2023
    Inventors: Jae Keun PARK, Do Hyun KIM, Sung Hyun JO, Seung Joon LEE, Jae Sang LIM
  • Publication number: 20230011932
    Abstract: A battery pack having at least one battery module including at least one battery cell, a case tray configured to support the at least one battery module, a case cover coupled to the case tray such that the at least one battery module is located between the case tray and the case cover, and a sealing gasket disposed between the case tray and the case cover to prevent penetration of moisture or foreign substances into the battery module is provided. The sealing gasket includes at least one position guide configured to guide positioning of the sealing gasket between the case tray and the case cover when the case tray and the case cover are coupled to each other.
    Type: Application
    Filed: October 13, 2021
    Publication date: January 12, 2023
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Young-Jin KIM, Yong-Shik SHIN, Do-Wung SON, Seung-Hyun YUN, Byeong-Yoon JUNG, Sung-Man CHOI
  • Publication number: 20230005884
    Abstract: A semiconductor package including a package substrate including first and second bonding pads, third bonding pads spaced apart from the first bonding pads, and fourth bonding pads spaced apart from the second bonding pads; a first chip stack including first chips stacked on the package substrate, each first chip including first signal pads and first power/ground pads alternately arranged; a second chip stack including second chips stacked on the first chip stack, each second chip including second signal pads and second power/ground pads alternately arranged; first lower wires that connect the first signal pads to the first bonding pads; second lower wires that connect the first power/ground pads to the second bonding pads; first upper wires that connect the second signal pads of the second chips to the third bonding pads; and second upper wires that connect the second power/ground pads of the second chips to the fourth bonding pads.
    Type: Application
    Filed: February 7, 2022
    Publication date: January 5, 2023
    Inventors: Minkyeong PARK, Do-Hyun KIM, Jaekyu SUNG
  • Publication number: 20220415769
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: August 29, 2022
    Publication date: December 29, 2022
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Publication number: 20220415906
    Abstract: A semiconductor memory device and a method for manufacturing the same. The semiconductor memory device may include a substrate, a first lower wire pattern and a first upper wire pattern stacked on the substrate, and spaced apart from each other; a second lower wire pattern and a second upper wire pattern stacked on the substrate, spaced apart from each other, and spaced apart from the first lower and upper wire patterns; a first gate line surrounding the first lower wire pattern and the first upper wire pattern; a second gate line surrounding the second lower wire pattern and the second upper wire pattern and spaced apart from the first gate line; a first lower source/drain area; a first upper source/drain area; and a first overlapping contact that electrically connects the first lower source/drain area, the first upper source/drain area and the second gate line to each other.
    Type: Application
    Filed: January 17, 2022
    Publication date: December 29, 2022
    Inventors: Sung Il Park, Jae Hyun Park, Min Gyu Kim, Do Young Choi, Dae Won Ha
  • Publication number: 20220404972
    Abstract: An operation method includes buffering data chunks to be programmed in the multi-level cells in a write buffer; backing up at least one backup data chunk of the data chunks to a backup memory; determining a program sequence of the data chunks, the program sequence for programming a non-backup data chunk among the data chunks to the multi-level cells through a second step program operation of the multi-step program operation; and controlling the memory device to program the data chunks in the multi-level cells, based on the program sequence, by performing first and second step program operations of the multi-step program operation in a first page of the multi-level cells, the second step program operation performed in the first page later than another first step program operation performed in a second page subsequent to the first page.
    Type: Application
    Filed: November 29, 2021
    Publication date: December 22, 2022
    Inventors: Jae Wan YEON, Do Hun KIM, Ju Hyun KIM, Jin Yeong KIM
  • Publication number: 20220408091
    Abstract: There is provided an video encoding/decoding method and apparatus. The video decoding method comprises acquiring a bitstream including a predetermined context element, performing at least one of a context model determination, a probability update, and a probability interval determination on the predetermined syntax element, and arithmetically decoding the predetermined syntax element on the basis of a result of the performance.
    Type: Application
    Filed: August 24, 2022
    Publication date: December 22, 2022
    Applicants: Electronics and Telecommunications Research Institute, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITY
    Inventors: Jin Ho LEE, Jung Won KANG, Ha Hyun LEE, Sung Chang LIM, Hui Yong KIM, Jae Gon KIM, Do Hyeon PARK, Yong Uk YOON, Yung Lyul LEE
  • Publication number: 20220406817
    Abstract: A display device includes conductive layers including wires and conductive patterns in a display area and a pad area, a via layer on the conductive layers, a first electrode and a second electrode on the via layer in the display area and spaced apart from each other, a first insulating layer on the first electrode and the second electrode, light emitting elements on the first electrode and the second electrode spaced apart from each other on the first insulating layer, and a first connection electrode on the first electrode and electrically contacting the light emitting elements, and a second connection electrode on the second electrode and electrically contacting the light emitting elements, each of the conductive layers includes a first metal layer and a second metal layer on the first metal layer, and the second metal layer contains copper and has a grain size of about 155 nm or less.
    Type: Application
    Filed: February 15, 2022
    Publication date: December 22, 2022
    Applicant: Samsung Display Co., LTD.
    Inventors: Joon Yong PARK, Gyung Min BAEK, Shin Il CHOI, Do Keun SONG, Young Rok KIM, Jong Hyun CHOUNG
  • Patent number: 11526974
    Abstract: A method for photographing an image performed by a computer device according to an embodiment of the present application includes obtaining a screen division value for photographing an image, classifying a photographing screen into a plurality of sections based on the screen division value, photographing a first image by focusing a first section among the plurality of sections, photographing a second image by focusing a second section among the plurality of sections and transmitting the first image and the second image to a server. According to the method, it is capable of reading whether an image is actually photographed without having a separate ToF module, and applicable to an outdoor environment on which interference from other light rays is strong.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: December 13, 2022
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Min Ki Hong, Chang Hyun Park, Do Yeon Kim, Se Hyeon Park, Kwan Sik Yoon, Sol Bi Hwang, Jae Hyeon Lee, Yong Hyun Jeong, Hyun Chui Park
  • Patent number: 11524047
    Abstract: The present invention relates to pharmaceutical compositions for preventing or treating pulmonary metastasis of cancer. More specifically, the present invention relates to compositions that enhance anti-cancer immunity of the lung rather than induce death of advanced cancer, thus being effective in inhibiting, preventing or treating pulmonary metastasis of cancer.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: December 13, 2022
    Assignee: Industry-University Cooperation Foundation Hanyang University
    Inventors: Je-Min Choi, Do-Hyun Kim
  • Publication number: 20220390716
    Abstract: A lens assembly includes a plurality of lens arrays sequentially disposed from an object side toward an image side, wherein each lens array includes a plurality of lenses, and a plurality of lenses included in a lens array of the plurality of lens arrays, disposed to be closest to the image side have a length in a first axis direction, perpendicular to an optical axis, longer than a length in a second axis direction, perpendicular to both the optical axis and the first axis direction.
    Type: Application
    Filed: April 26, 2022
    Publication date: December 8, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Joo JO, Do Hyeong JANG, Byung Hyun KIM
  • Publication number: 20220380360
    Abstract: The present disclosure relates to a benzoselenophene-based compound, a method of preparing the benzoselenophene-based compound, and a pharmaceutical composition and antibody-drug conjugate including the benzoselenophene-based compound.
    Type: Application
    Filed: July 29, 2022
    Publication date: December 1, 2022
    Inventors: Dongyeol LIM, Min Cheol KIM, Amol MHETRE, Do-Hyun NAM
  • Publication number: 20220383481
    Abstract: An apparatus for deep fake image discrimination according to an embodiment includes an interface unit configured to receive image data and a classifier configured to determine whether the image data input through the interface unit is a deep fake image, and the classifier is trained to determine a deep fake image based on a synthetic image generated by swapping a portion of a real image with a fake image generated by self-replicating the real image.
    Type: Application
    Filed: May 25, 2022
    Publication date: December 1, 2022
    Inventors: Do-Yeon KIM, Jong-Won CHOI, Pyoung-Geon KIM, Yong-Hyun JEONG, Young-Min RO
  • Patent number: 11511309
    Abstract: The present invention relates to a double slit coating die, and an electrode active material coating apparatus comprising same, the double slit coating die comprising first to fourth blocks which are positioned sequentially adjacent to each other, and having a structure in which the positions of the first and second blocks can move in a direction tilted at an angle ? with respect to the interface between the second and third blocks. The present invention has the effects of preventing slip surfaces between blocks constituting the die from spreading apart, and reducing offset in a coating process.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: November 29, 2022
    Inventors: Ki Tae Kim, Do Hyun Lee, Taek Soo Lee, Cheol Woo Kim, Young Joon Jo, Sang Hoon Choy
  • Patent number: 11508687
    Abstract: A semiconductor package may include a substrate including a first coupling terminal and a second coupling terminal, a first chip disposed on the substrate, the first chip including a first pad and a second pad, and a connection structure connecting the first coupling terminal to the first pad. A portion of the connection structure may be in contact with a first side surface of the first chip. The connection structure may include a connection conductor electrically connecting the first pad to the first coupling terminal.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: November 22, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Minkyeong Park, Do-Hyun Kim
  • Patent number: D974283
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: January 3, 2023
    Inventors: Jeong-Hyeon Kim, Do-Hyun Park, Jun-Yeob Seong, Jong-Ha Jeong
  • Patent number: D974284
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: January 3, 2023
    Inventors: Jeong-Hyeon Kim, Do-Hyun Park, Jun-Yeob Seong, Jong-Ha Jeong