Patents by Inventor Do-II Kong

Do-II Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-Stacked Structures of Semiconductor Packages
    Publication number: 20160086917
    Abstract: A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.
    Type: Application
    Filed: September 9, 2015
    Publication date: March 24, 2016
    Inventors: Jae-Bum Byun, Cheol Kwon, Jong-Yun Yun, Do-II Kong, Sung-Chul Hur