Abstract: A medical imaging apparatus includes an X-ray source configured to irradiate X-rays to an object; an X-ray detector configured to detect the X-rays radiated from the X-ray source to obtain projection data; and an image processor configured to reconstruct the projection data based on a motion parameter representing movement of at least one of the object, the X-ray source, and the X-ray detector, and to generate a medical image by applying a weighting process to the reconstructed projection data.

Abstract: A medical imaging apparatus includes an X-ray source configured to irradiate X-rays to an object; an X-ray detector configured to detect the X-rays radiated from the X-ray source to obtain projection data; and an image processor configured to reconstruct the projection data based on a motion parameter representing movement of at least one of the object, the X-ray source, and the X-ray detector, and to generate a medical image by applying a weighting process to the reconstructed projection data.

Abstract: Provided is a strain sensing device using reduced graphene oxide (R-GO). The strain sensing device includes a flexible substrate, a gate electrode formed on the flexible substrate, a gate insulating layer configured to cover the gate electrode and include a part formed of a flexible material, an active layer formed of R-GO for sensing a strain, on the gate insulating layer, and a source and drain electrode formed on the active layer.

Abstract: Provided is a strain sensing device using reduced graphene oxide (R-GO). The strain sensing device includes a flexible substrate, a gate electrode formed on the flexible substrate, a gate insulating layer configured to cover the gate electrode and include a part formed of a flexible material, an active layer formed of R-GO for sensing a strain, on the gate insulating layer, and a source and drain electrode formed on the active layer.

Abstract: A picker for a module IC handler includes a plurality of grippers. Each gripper includes first and second jaws, and one or more cylinders or other actuators for driving the first and second jaws. Each gripper also includes a damping device that damps movements of the jaws to reduce an impact that can occur as the jaws grip a module IC. The grippers may also include one or more sensors for sensing when the jaws have grasped a module IC, or for sensing the position of the gripper relative to the module IC.

Abstract: A picker for a module IC handler includes a plurality of grippers. Each gripper includes first and second jaws, and one or more cylinders or other actuators for driving the first and second jaws. Each gripper also includes a damping device that damps movements of the jaws to reduce an impact that can occur as the jaws grip a module IC. The grippers may also include one or more sensors for sensing when the jaws have grasped a module IC, or for sensing the position of the gripper relative to the module IC.

Abstract: A gripper for the picking apparatus of a module IC handler including a gripper body, first to third supports vertically formed at a lower part of the gripper body, a cylinder for driving a jaw located between first and second supports and second and third supports, a pair of jaws movably connected at a lower part of the cylinder, for picking the module IC, a damping mechanism for reducing an impact occurred upon picking the module IC by the jaw, and a module IC sensor for sensing the module IC upon moving the jaw. The present invention reduces damage of the module ICs with the damping mechanism upon picking the module ICs. Also, the gripper easily and exactly grips the module ICs, thus accomplishing the working performance.