Patents by Inventor Do-il Kong

Do-il Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10120593
    Abstract: A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: November 6, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-beom Byun, Hu Zhao, Jong-gyu Park, Do-il Kong, Chung-hyun Ryu, Eok-soo Shim
  • Patent number: 9564417
    Abstract: A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: February 7, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Bum Byun, Cheol Kwon, Jong-Yun Yun, Do-Il Kong, Sung-Chul Hur
  • Publication number: 20160342346
    Abstract: A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.
    Type: Application
    Filed: May 20, 2016
    Publication date: November 24, 2016
    Inventors: Jae-beom Byun, Hu Zhao, Jong-gyu Park, Do-il Kong, Chung-hyun Ryu, Eok-soo Shim
  • Patent number: 7909251
    Abstract: A memory card pack includes an adaptor insertable in a memory slot of an application device and including a semiconductor chip having a control circuit therein and an expansion socket including a plurality of slots, each slot being configured to receive a memory card, and a plurality of contacts electrically connecting the control circuit to each memory card.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: March 22, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Doo-jin Yi, Do-il Kong, Il-ki Kim
  • Publication number: 20070181699
    Abstract: A memory card pack includes an adaptor insertable in a memory slot of an application device and including a semiconductor chip having a control circuit therein and an expansion socket including a plurality of slots, each slot being configured to receive a memory card, and a plurality of contacts electrically connecting the control circuit to each memory card.
    Type: Application
    Filed: January 17, 2007
    Publication date: August 9, 2007
    Inventors: Doo-jin Yi, Do-il Kong, Il-ki Kim