Abstract: A method for replicating a holographic optical element and a holographic optical element replicated thereby are provided. The holographic optical element is larger than a master. The master has a holographic grating pattern generated on the master by interference of the reflected, diffracted or transmitted beam generated by irradiating the master having a specific diffraction grating pattern formed thereon with a laser beam.

Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.

Abstract: A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

Abstract: An image sensor package includes a substrate, an image sensor mounted on the substrate, a bonding wire connecting the image sensor to the substrate, a reflector disposed on the image sensor, a sealing member sealing the bonding wire and a portion of the image sensor, and covering at least a portion of the reflector, the sealing member including a hole exposing an effective imaging plane of the image sensor, and a filter attached to the sealing member.

Abstract: An image sensor package includes a substrate; an image sensor connected to the substrate; a film member disposed on the substrate and defining a hole for exposing an effective image pickup surface of the image sensor; a bonding wire connecting the image sensor to the substrate; and a filter attached to the film member. The film member includes at least one void therein and at least a portion of the bonding wire is contained within the film member.

Abstract: An image sensor package includes a substrate, an image sensor mounted on the substrate, a bonding wire connecting the image sensor to the substrate, a reflector disposed on the image sensor, a sealing member sealing the bonding wire and a portion of the image sensor, and covering at least a portion of the reflector, the sealing member including a hole exposing an effective imaging plane of the image sensor, and a filter attached to the sealing member.

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

Abstract: An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.

Abstract: An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.

Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

Abstract: A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

Abstract: The method of manufacturing a package comprising: preparing a strip substrate having a plurality of separate package regions which are partitioned by a dicing region and via pads which are connected to one ends of plated tails which are divided to be disconnected in the dicing region; mounting at least one electronic component on at least one surface of each package region of the substrate; forming a connection pattern having conductivity in disconnected portions of the plated tails to form electrical connections therebetween; forming a molded part on the surface of the substrate to enclose the electronic component; forming at least one via penetrating through the molded part by applying current through the plated tails; and dicing the substrate in the dicing region to divide the substrate into separate packages, each having the connection pattern exposed to the exterior of the substrate.

Abstract: The package includes: a substrate having at least one circuit layer; at least one electronic component mounted on at least one surface of the substrate; a molded part formed on the surface of the substrate to enclose the electronic component; at least one via formed in the molded part to be electrically connected to the circuit layer of the substrate; and a pattern connected to one end of a plated tail connected to the circuit layer connected to the via and exposed to the exterior of the substrate.

Abstract: A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.

Abstract: There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire.

Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Abstract: There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

Abstract: The semiconductor package according to an exemplary embodiment includes: a substrate having a plurality of circuit layers and connection pads which are provided between a plurality of insulating layers; a plated tail part of which one end is electrically connected to the connection pad; a dicing part provided in contact with the other end of the plated tail part; a molded part provided on the substrate; and molded part vias provided on the connection pads and penetrating through the molded part.