Patents by Inventor Do-Keun Lee

Do-Keun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240164084
    Abstract: A semiconductor device includes: a substrate includes an active area; a first landing pad connected to the active area and disposed on the substrate; a second landing pad connected to the active area, and spaced apart from the first landing pad, wherein the second landing pad is disposed on the substrate; a first lower electrode disposed on the first landing pad and extending in a direction substantially perpendicular to the substrate; a second lower electrode disposed on the second landing pad and extending in the direction substantially perpendicular to the substrate; a dielectric layer extending along the first lower electrode and the second lower electrode; and an upper electrode disposed on the dielectric layer, wherein a first upper surface of the first landing pad is disposed below a second upper surface of the second landing pad with respect to a lower surface of the substrate.
    Type: Application
    Filed: August 22, 2023
    Publication date: May 16, 2024
    Inventors: Do Keun LEE, Dong Wook KIM, Yang Doo KIM, Sang Wuk PARK, Min Kyu SUH, Geon Yeop LEE, Jung Pyo HONG
  • Publication number: 20240155212
    Abstract: A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.
    Type: Application
    Filed: May 16, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Hwan KIM, Ju Ho KIM, Sang Hyun JI, Jung Hyun PARK, Nam Keun OH, Doo Seub SHIN, Dong Hoon LEE, Jong Eun PARK, Sangik CHO
  • Publication number: 20240128347
    Abstract: A semiconductor device and a method of fabricating a semiconductor device, the device including a fin-type pattern extending in a first direction; a gate electrode extending in a second direction over the fin-type pattern, the second direction being different from the first direction; spacers on sidewalls of the gate electrode; a capping structure on the gate electrode and the spacers, the capping structure including a first capping pattern and a second capping pattern, the second capping pattern being on the first capping pattern; and an interlayer insulating film surrounding sidewalls of each of the spacers and sidewalls of the capping structure, the interlayer insulating film being in contact with the first capping pattern.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Nam Gyu CHO, Rak Hwan KIM, Hyeok-Jun SON, Do Sun LEE, Won Keun CHUNG
  • Publication number: 20240121996
    Abstract: A display device is provided. The display device includes a substrate including a display area and a pad area, which is disposed on one side of the display area, a plurality of conductive layers disposed on the substrate, in the display area and the pad area, a passivation layer disposed on the conductive layers, and a plurality of light-emitting elements disposed on the passivation layer, in the display area, and spaced apart from one another, wherein at least one of the conductive layers includes a first metal layer, a second metal layer, which is disposed on the first metal layer, and a third metal layer, which is disposed on the second metal layer, the first metal layer includes vanadium (V), the second metal layer includes aluminum (Al) or an Al alloy, and the third metal layer includes V or titanium (Ti).
    Type: Application
    Filed: July 31, 2023
    Publication date: April 11, 2024
    Inventors: Hyun Eok SHIN, Sang Gab KIM, Joon Yong PARK, Do Keun SONG, Su Kyoung YANG, Dong Min LEE
  • Patent number: 11951890
    Abstract: Proposed are a seat side bolster apparatus and a control method thereof. The seat side bolster apparatus of the disclosure includes a driving unit, which is provided under a foam pad of a seat cushion, is moved upwards and downwards by operation of an actuator, and presses the foam pad upwards when moving upwards, and a covering bracket, which is connected to the driving unit so as to be moved upwards and downwards together with the driving unit and to which an end of a covering enveloping the foam pad of the seat cushion is fixed.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: April 9, 2024
    Assignee: HYUNDAI TRANSYS INCORPORATED
    Inventors: Jae Keun Park, Do Hyun Kim, Sung Hyun Jo, Seung Joon Lee, Jae Sang Lim
  • Publication number: 20080249213
    Abstract: Disclosed is a polyetherester thermoplastic elastomer resin composition with excellent Hex-elasticity and durability, which comprises 10 to 70% by weight of low hardness polyetherester block copolymer having shore-hardness not more than 40D, 55 to 15% by weight of high hardness polyetherester block copolymer having shore-hardness not less than 50D and 35 to 15% by weight of polybutylene terephthalate, and having flex-elasticity in the range of 2,500 to 4,600 kgf/cm2. The polyetherester thermoplastic elastomer resin composition of the present invention has excellent durability, processing workability, formability and scratch-resistance, as well as satisfactory flexibility and mechanical properties, especially, flex-elasticity. Additionally, the polyetherester thermoplastic elastomer resin composition of the present invention has advantages such as excellent deploying property and horn workability when it is employed in production of covers for air bags of automobiles.
    Type: Application
    Filed: February 28, 2006
    Publication date: October 9, 2008
    Applicant: Kolon Industries, Inc.
    Inventors: Sung-Keun Park, Eun-Ha Park, Do-Keun Lee