Patents by Inventor Do Seop KIM

Do Seop KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9543673
    Abstract: A connecting pin for an electronic circuit board electrically connects a lead of a component to be surface-mounted to the electronic circuit board to a coating layer on an inner wall of a through-hole of the electronic circuit board. The connecting pin includes a cylindrical body formed of an electrically conductive metal, which is inserted into the through-hole of the electronic circuit board. The lead of the component is press-fitted, and inner surface of the cylindrical body is provided with a plurality of small protrusions deformable when contacting protrusions of the press-fitted lead.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: January 10, 2017
    Assignee: HYUNDAI MOTOR COMPANY
    Inventor: Do Seop Kim
  • Publication number: 20150255901
    Abstract: A connecting pin for an electronic circuit board electrically connects a lead of a component to be surface-mounted to the electronic circuit board to a coating layer on an inner wall of a through-hole of the electronic circuit board. The connecting pin includes a cylindrical body formed of an electrically conductive metal, which is inserted into the through-hole of the electronic circuit board. The lead of the component is press-fitted, and inner surface of the cylindrical body is provided with a plurality of small protrusions deformable when contacting protrusions of the press-fitted lead.
    Type: Application
    Filed: October 9, 2014
    Publication date: September 10, 2015
    Inventor: Do Seop KIM