Patents by Inventor Do Sung Chun

Do Sung Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin semiconductor package including stacked dies
    Patent number: 7211900
    Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.
    Type: Grant
    Filed: May 13, 2005
    Date of Patent: May 1, 2007
    Assignee: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Do Sung Chun, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio
  • Semiconductor package and method for fabricating the same
    Patent number: 7190071
    Abstract: There is provided a semiconductor package and method for fabricating the same.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: March 13, 2007
    Assignee: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio
  • Semiconductor package and method for fabricating the same
    Patent number: 6982488
    Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: January 3, 2006
    Assignee: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Do Sung Chun, Soon Goo Lee, Il Kwon Shim, Vincent DiCaprio
  • Semiconductor package and method for fabricating the same
    Patent number: 6798049
    Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: September 28, 2004
    Assignee: Amkor Technology Inc.
    Inventors: Won Sun Shin, Do Sung Chun, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio
  • Semiconductor package and method for fabricating the same
    Publication number: 20040164411
    Abstract: There is provided a semiconductor package and method for fabricating the same.
    Type: Application
    Filed: February 24, 2004
    Publication date: August 26, 2004
    Applicant: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio
  • Semiconductor package and method for fabricating the same
    Patent number: 6717248
    Abstract: There is provided a semiconductor package and method for fabricating the same.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: April 6, 2004
    Assignee: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent D. DiCaprio
  • Semiconductor package and method for fabricating the smae
    Publication number: 20040007771
    Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.
    Type: Application
    Filed: June 20, 2003
    Publication date: January 15, 2004
    Applicant: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Do Sung Chun, Soon Goo Lee, Il Kwon Shim, Vincent DiCaprio
  • Semiconductor package and method for fabricating the same
    Publication number: 20030100142
    Abstract: There is provided a semiconductor package and method for fabricating the same.
    Type: Application
    Filed: November 26, 2002
    Publication date: May 29, 2003
    Applicant: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio
  • Semiconductor package and method for fabricating the same
    Patent number: 6515356
    Abstract: There is provided a semiconductor package and method for fabricating the same.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: February 4, 2003
    Assignee: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio
  • Semiconductor package and method for fabricating the same
    Patent number: RE40112
    Abstract: Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: February 26, 2008
    Assignee: Amkor Technology, Inc.
    Inventors: Won Sun Shin, Do Sung Chun, Sang Ho Lee, Seon Goo Lee, Vincent DiCaprio