Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode, the first electrode, the second electrode and the separator being wound around a winding axis to define a core and an outer peripheral surface. The first electrode and the second electrode include a first uncoated region and a second uncoated region along a winding direction, respectively, and an active material layer coating is absent in the first uncoated region and the second uncoated region. The battery further includes a housing receiving the electrode assembly through an opening formed at a bottom, a first current collector coupled to the first uncoated region and disposed within the housing, a cap covering the opening, a spacer interposed between the cap and the electrode assembly to fix the electrode assembly and seal the housing, and a terminal electrically connected to the second uncoated region.

Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.

Abstract: A battery includes an electrode assembly including a first uncoated region and a second uncoated region; a battery housing accommodating the electrode assembly and electrically connected to the second uncoated region; a cap to cover an open portion on bottom of the battery housing; a first electrode terminal passing through a partially closed portion of the battery housing and being electrically isolated from the battery housing; and a first current collector coupled to the first uncoated region and connected to the first electrode terminal.

Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.

Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode wound around a winding axis to define a core and an outer circumferential surface, the first electrode including a first uncoated region in which an active material layer is not coated along a winding direction; a housing accommodating the electrode assembly through an open portion at a lower end thereof; a first current collector coupled to the first uncoated region and disposed in the housing; a cap to cover the open portion; and a spacer between the first current collector and the cap and having a height corresponding to a distance between the first current collector and the cap.

Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.

Abstract: A storage device including a nonvolatile memory device that includes a nonvolatile memory cell array including a string including first and second memory cells stacked sequentially, and an OTP memory cell array that stores reference count values, the first and second memory cells respectively connected to first and second word lines; a controller including a processor that generates a read command for the first memory cell; a read level generator including a counter that receives the read command and calculates an off-cell count value of memory cells connected to the second word line, and a comparator that receives a first reference count value from the OTP memory cell array, compares the off-cell count value with the first reference count value to determine a threshold voltage shift of the second memory cell, and determines a read level of the first memory cell based on the threshold voltage shift.

Abstract: A blade for a gas turbine includes an external structure including a plurality of seating grooves which are separately disposed in a chord direction toward a trailing edge from a leading edge, an internal structure received in the external structure and including a plurality of protrusions protruding toward an internal side of the external structure, a plurality of porous strips combined to the seating groove in an attachable/detachable way, and a coolant channel formed for a coolant to flow among the porous strip, the neighboring protrusions, and an external side of the internal structure.

Abstract: A blade for a gas turbine according to an exemplary embodiment of the present invention includes an external structure including a plurality of seating grooves which are separately disposed in a chord direction toward a trailing edge from a leading edge, an internal structure received in the external structure and including a plurality of protrusions protruding toward an internal side of the external structure, a plurality of porous slots combined to the seating groove in an attachable/detachable way, and a coolant channel formed for a coolant to flow among the porous slot, the neighboring protrusions, and an external side of the internal structure.

Abstract: The present invention provides an automated experiment apparatus and an automated experiment method using the same for putting a sample into a pressure vessel and automatically performing a chemical and/or physical reaction of the sample under a predetermined temperature and pressure. According to the embodiments of the present disclosure, it is possible to automatically perform an experiment from the beginning to the end without intervention of an user. As a result, it is possible to prevent a risk of gas leakage and human exposure to a harmful gas due to a manual operation. The apparatus comprises a controller which is configured to automatically perform a reaction process under a predetermined temperature and pressure in a state in which a sample holding member is air-tightly fixed to a pressure vessel and the sample is accommodated in a sample receiving chamber of the pressure vessel.

Abstract: The present invention provides an automated experiment apparatus and an automated experiment method using the same for putting a sample into a pressure vessel and automatically performing a chemical and/or physical reaction of the sample under a predetermined temperature and pressure. According to the embodiments of the present disclosure, it is possible to automatically perform an experiment from the beginning to the end without intervention of an user. As a result, it is possible to prevent a risk of gas leakage and human exposure to a harmful gas due to a manual operation. The apparatus comprises a controller which is configured to automatically perform a reaction process under a predetermined temperature and pressure in a state in which a sample holding member is air-tightly fixed to a pressure vessel and the sample is accommodated in a sample receiving chamber of the pressure vessel.

Abstract: A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 ?m to 10 ?m.

Abstract: A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 ?m to 10 ?m.

Abstract: An airtight container for a reaction experiment, includes a reaction container made of Teflon, the reaction container having an opening in at least a portion thereof; and a casing configured to support and enclose a circumferential outer surface of the reaction container. Further, the airtight container for the reaction experiment includes a Teflon film configured to close the opening of the reaction container; and a pressing part configured to bring the Teflon film into close contact with the reaction container. Furthermore, the airtight container for the reaction experiment includes a cover configured to apply a force to the pressing part so that the Teflon film is kept in close contact with the reaction container.

Abstract: An optical pickup apparatus according to an embodiment includes a semiconductor laser, an objective lens, a grating, and a light detecting device. The grating is installed between the semiconductor laser and the objective lens to divide the light beam emitted from the semiconductor laser into three beams or more including a main beam and a sub-beam. The light detecting device receives the divided light reflected by the optical recording medium. The grating includes a first diffraction grating and a second diffraction grating. The first diffraction grating has patterns formed for dividing a sub-beam with respect to a first optical recording medium having a first track pitch, and second diffraction grating has patterns formed for dividing the sub-beam divided by the first diffraction grating into sub-beams with respect to a second optical recording medium having a second track pitch.

Abstract: The present invention relates to an alloy for bonding wire used to connect a semiconductor chip and a lead frame and, more particularly, to a gold-based alloy for bonding wire of a semiconductor device which is excellent in the strengths at room temperature and under hot conditions after bonding, capable of controlling the ball size to be smaller in bonding, and preventive of a short between wires, the gold-based alloy for bonding wire of a semiconductor device being characterized by containing 0.5 to 5.0 wt. % of Pd, 5 to 50 wt.PPM of Ba, each 1 to 10 wt.PPM of at least one selected from the group consisting of Be and Ca, and Au for the rest, thereby having excellent strengths at room temperature and under hot conditions after bonding, controlling the size of a ball smaller, and preventing a short between wires.