Patents by Inventor Do-Woo Ki

Do-Woo Ki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12787709
    Abstract: An adhesive sheet for a semiconductor device includes a dicing tape integrated backside protective film disposed at predetermined intervals in a longitudinal direction of a separator, and a support film disposed to be spaced apart from the outside of the dicing tape integrated backside protective film to include both long sides of the separator, in which the support film includes an adhesive layer in contact with the separator and a second dicing tape formed on the adhesive layer, and the second dicing tape protrudes toward the dicing tape integrated backside protective film more than the adhesive layer of the support film.
    Type: Grant
    Filed: December 27, 2024
    Date of Patent: November 3, 2026
    Assignee: INNOX Advanced Materials Co., Ltd.
    Inventors: Keun-Young Yoon, Young-Gun Kim, Yeong-Seok Cho, Duck-Soo Kim, Do-Woo Ki
  • Publication number: 20250218851
    Abstract: An adhesive sheet for a semiconductor device includes a dicing tape integrated backside protective film disposed at predetermined intervals in a longitudinal direction of a separator, and a support film disposed to be spaced apart from the outside of the dicing tape integrated backside protective film to include both long sides of the separator, in which the support film includes an adhesive layer in contact with the separator and a second dicing tape formed on the adhesive layer, and the second dicing tape protrudes toward the dicing tape integrated backside protective film more than the adhesive layer of the support film.
    Type: Application
    Filed: December 27, 2024
    Publication date: July 3, 2025
    Inventors: Keun-Young Yoon, Young-Gun Kim, Yeong-Seok Cho, Duck-Soo Kim, Do-Woo Ki