Patents by Inventor Do-Woo Lee

Do-Woo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molding resin tablet feeding apparatus having weighing unit
    Patent number: 7501590
    Abstract: A molding resin tablet feeding apparatus may have a tablet weighing unit for weighing a molding resin tablet to sort out a faulty molding resin tablet. The weighing unit may be elastically deformed according to the weight of the molding resin tablet, and may further include a strain gauge for outputting an electric change caused by the elastic deformation. A controller may compare the electric change to tablet weight information to determine the validity of the molding resin tablet.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: March 10, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ok-Sun Jung, Hee-Chul Kang, Byong-Do Na, Young-Jin Hwang, Do-Woo Lee, Yong-Hwan Kim, Hee-Ju Seo
  • Molding resin tablet feeding apparatus having weighing unit
    Publication number: 20070023208
    Abstract: A molding resin tablet feeding apparatus may have a tablet weighing unit for weighing a molding resin tablet to sort out a faulty molding resin tablet. The weighing unit may be elastically deformed according to the weight of the molding resin tablet, and may further include a strain gauge for outputting an electric change caused by the elastic deformation. A controller may compare the electric change to tablet weight information to determine the validity of the molding resin tablet.
    Type: Application
    Filed: December 27, 2005
    Publication date: February 1, 2007
    Inventors: Ok-Sun Jung, Hee-Chul Kang, Byong-Do Na, Young-Jin Hwang, Do-Woo Lee, Yong-Hwan Kim, Hee-Ju Seo
  • Method and apparatus for managing plating interruptions
    Publication number: 20040262164
    Abstract: A plating method and apparatus including at least one plating bath including a plating solution used for plating at least one workpiece and a source providing a first current, wherein the first current is supplied to the plating solution when plating the at least one workpiece, and providing a second current, lower than the first current, wherein the second current is supplied to the plating solution during an interruption. The plating method and apparatus may include at least one main bath, at least one main anode, at least one auxiliary bath, at least one auxiliary anode, and/or a conveying unit. A portion of the conveying unit or the at least one workpiece may act as a cathode or anode. The plating method and apparatus may continuously expose a workpiece to a plating solution.
    Type: Application
    Filed: February 17, 2004
    Publication date: December 30, 2004
    Inventors: Sang-Hun Han, Jun Eui Lee, Do-Woo Lee, Young Cheol Choi, Tea Seog Um