Patents by Inventor Do Y. Yoon

Do Y. Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming a circuit assembly
    Patent number: 5633034
    Abstract: The invention relates to a process for forming a circuit assembly comprising (i) coating onto a substrate a layer of polyamic ester selected from a unique class of polyamic esters; (ii) imidizing the polyamic ester to form a layer of polyimide having an even surface and (iii) forming circuit conductors on the even surface of the polyimide.
    Type: Grant
    Filed: May 9, 1996
    Date of Patent: May 27, 1997
    Assignee: International Business Machines Corporation
    Inventors: Kenneth R. Carter, Richard A. DiPietro, James L. Hedrick, John P. Hummel, Robert D. Miller, Martha I. Sanchez, Willi Volksen, Do Y. Yoon
  • Circuit assembly with polyimide insulator
    Patent number: 5302851
    Abstract: The present invention relates to a circuit assembly comprising the polyimide poly(3,4'-oxydiphenylene pyromellitimide).
    Type: Grant
    Filed: December 19, 1991
    Date of Patent: April 12, 1994
    Assignee: International Business Machines Corporation
    Inventors: Moonhor Ree, Willi Volksen, Do Y. Yoon
  • Fine domain composite films of polyimide mixtures
    Patent number: 4954578
    Abstract: Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good adhesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.
    Type: Grant
    Filed: October 25, 1988
    Date of Patent: September 4, 1990
    Assignee: International Business Machines Corporation
    Inventors: Moonhor Ree, Sally A. Swanson, Willi Volksen, Do Y. Yoon
  • Process for coating a substrate with polyimide
    Patent number: 4467000
    Abstract: A process for coating a substrate to provide good planarization and good mechanical and thermal stability, the process comprising applying to the substrate an amino-terminated oligomer and an ester, with the oligomer being formed from an aromatic diamine and from an aromatic dianhydride, and the ester being formed from an aromatic tetracarboxylic acid and an alcohol, and by reacting said oligomer and said ester in situ, with the process being characterized in that the ester reacts with an amine group of the oligomer to form a high molecular weight polyamide at a temperature between 40.degree. C. and 140.degree. C., and continues to react to form a cyclic imide.
    Type: Grant
    Filed: March 29, 1983
    Date of Patent: August 21, 1984
    Assignee: International Business Machines Corporation
    Inventors: James Economy, Willi Volksen, Do Y. Yoon