Abstract: A micro LCD attachment apparatus (10) for affixing an LCD imager (20) to an LCD frame (18) at a fixed relationship optionally determined by a tape (34). A base (12) has an attachment plate (14) and a plurality of vacuum slots (18) for selectively holding the LCD frame (18). The attachment plate (14) has a shaped aperture (22) for accepting the LCD imager (20) and a plurality of UV light pipes (30) for curing an adhesive (32) which is applied to the LCD imager (20). A hold down arm (24) pivots about a pivot stud (26) to position a hold down pin (28) to hold the LCD imager (20) in place on the LCD frame (18) while the adhesive (32) is cured.

Abstract: An LCD assembly (10) having an LCD device mounted on a substrate (12) with a flex cable and connector assembly (14) electrically and mechanically attached thereto. A mounting border (16) has a plurality of border screw holes (40) isolated from a main body (30) of the mounting border (16) by a plurality of stress relief slots (34) such that the main body (39) connects to the border screw holes (40) only through a plurality of land areas (44). An aperture mask 18 is interposed between a LCD subassembly (28) and a frame (20). The frame (20) has a lens receptor (42) for accepting a field lens (22) secured in a lens mount. Mounting screws (26) secure the mounting border (16) to the frame (20).

Abstract: There is provided a base for an electronic package. The base includes a peripheral portion for a polymer adhesive and a central portion for one or more semiconductor devices. A lead support is adjacent the substrate and located between the peripheral portion and the central portion. When a polymer adhesive bonds a leadframe to the package base, the lead support prevents deflection of the inner lead tips.