Patents by Inventor Doc-hwa Na

Doc-hwa Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of post treating graphene and method of manufacturing graphene using the same
    Patent number: 9136112
    Abstract: Provided is a method of post treating graphene including providing graphene on a metal thin film, providing a carrier on the graphene, hardening the carrier, and removing the metal thin film from the graphene.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: September 15, 2015
    Assignee: Hanwha Techwin Co., Ltd.
    Inventors: Dong-Kwan Won, Seung-Min Cho, Jong-Hyuk Yoon, Doc-Hwa Na
  • METHOD OF POST TREATING GRAPHENE AND METHOD OF MANUFACTURING GRAPHENE USING THE SAME
    Publication number: 20130134384
    Abstract: Provided is a method of post treating graphene including providing graphene on a metal thin film, providing a carrier on the graphene, hardening the carrier, and removing the metal thin film from the graphene.
    Type: Application
    Filed: August 5, 2011
    Publication date: May 30, 2013
    Applicant: SAMSUNG TECHWIN CO., LTD.
    Inventors: Dong-Kwan Won, Seung-Min Cho, Jong-Hyuk Yoon, Doc-Hwa Na
  • Method of manufacturing a circuit board
    Patent number: 8186043
    Abstract: A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: May 29, 2012
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Sang-min Lee, Deok-heung Kim, Doc-hwa Na
  • CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110132651
    Abstract: A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern.
    Type: Application
    Filed: September 27, 2010
    Publication date: June 9, 2011
    Applicant: SAMSUNG TECHWIN CO., LTD.
    Inventors: Sang-min LEE, Deok-heung KIM, Doc-hwa NA