Patents by Inventor Dodgie Reigh M. Calpito

Dodgie Reigh M. Calpito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS AND METHODS OF MAKING SAME
    Publication number: 20120067940
    Abstract: Electrical contact structures suitable for use on the wafer-side of wafer translators are produced using the programmable features of a wire-bonding machine and further using subsequent steps including but not limited to, masking, etching, grinding, and annealing. In one aspect, multiple electronic flame-off (EFO) operations are performed to produce both a free-air ball at one end of a wire for ball bonding, and to produce a region of modified grain structure in the wire at a predetermined distance from the free-air ball. The grain structure modification obtained by EFO operations affects the tail termination operation of the wire bonding machine thereby controlling, at least in part, the contact structure height and tip shape.
    Type: Application
    Filed: May 12, 2011
    Publication date: March 22, 2012
    Inventor: Dodgie Reigh M. Calpito
  • Wire loop and method of forming the wire loop
    Patent number: 8048720
    Abstract: A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: November 1, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dodgie Reigh M. Calpito, O Dal Kwon
  • WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP
    Publication number: 20100230809
    Abstract: A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
    Type: Application
    Filed: January 30, 2008
    Publication date: September 16, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Dodgie Reigh M. Calpito, O Dal Kwon