Patents by Inventor Dohyuk Ha

Dohyuk Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250096486
    Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
    Type: Application
    Filed: November 29, 2024
    Publication date: March 20, 2025
    Inventors: Sanghoon PARK, Jungho PARK, Kwanghyun BAEK, Youngju LEE, Jungyub LEE, Juneseok LEE, Dohyuk HA, Jinsu HEO
  • Patent number: 12218407
    Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: February 4, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Juneseok Lee, Youngsub Kim, Sanghoon Park, Jungho Park, Kwanghyun Baek, Youngju Lee, Jungyub Lee, Dohyuk Ha, Jinsu Heo
  • Patent number: 12183969
    Abstract: The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: December 31, 2024
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sanghoon Park, Juneseok Lee, Dohyuk Ha, Jinsu Heo, Youngju Lee
  • Patent number: 12176620
    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: December 24, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Juneseok Lee, Jinsu Heo, Youngsub Kim, Jungho Park, Kwanghyun Baek, Youngju Lee, Kyoungho Jeong, Dohyuk Ha
  • Publication number: 20240405449
    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
    Type: Application
    Filed: August 9, 2024
    Publication date: December 5, 2024
    Inventors: Kwanghyun BAEK, Seungtae KO, Kijoon KIM, Juho SON, Sangho LEE, Youngju LEE, Jungyub LEE, Yonghun CHEON, Dohyuk HA
  • Patent number: 12160047
    Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: December 3, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sanghoon Park, Jungho Park, Kwanghyun Baek, Youngju Lee, Jungyub Lee, Juneseok Lee, Dohyuk Ha, Jinsu Heo
  • Patent number: 12062853
    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: August 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwanghyun Baek, Seungtae Ko, Kijoon Kim, Juho Son, Sangho Lee, Youngju Lee, Jungyub Lee, Yonghun Cheon, Dohyuk Ha
  • Publication number: 20240266716
    Abstract: A radio unit (RU) module may include: a first substrate comprising a first surface and a second surface opposite to the first surface; a radio frequency integrated circuit (RFIC); a second substrate comprising a plurality of layers that comprises a plurality of second layers that comprises at least one first layer; a plurality of antenna elements comprising a first antenna element and a second antenna element; and a plurality of conductivity members comprising a conductivity member. The RFIC may be coupled to the first surface of the first substrate. The second substrate may be coupled to the second surface of the first substrate. The plurality of antenna elements may be disposed on the at least one first layer of the second substrate. The plurality of conductivity members may be disposed across the plurality of second layers of the second substrate.
    Type: Application
    Filed: October 26, 2023
    Publication date: August 8, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngsub KIM, Juneseok LEE, Kwanghyun BAEK, Jungyub LEE, Dohyuk HA
  • Publication number: 20240235059
    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 11, 2024
    Inventors: Juneseok LEE, Jinsu Heo, Youngsub Kim, Jungho Park, Kwanghyun Baek, Youngju Lee, Kyoungho Jeong, Dohyuk Ha
  • Patent number: 12027774
    Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: July 2, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dohyuk Ha, Kwanghyun Baek, Juneseok Lee, Jinsu Heo, Youngju Lee, Jungyub Lee
  • Patent number: 12009579
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: June 11, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sanghoon Park, Juneseok Lee, Dohyuk Ha, Jungyub Lee, Jinsu Heo, Youngju Lee
  • Publication number: 20240136734
    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Inventors: Juneseok LEE, Jinsu Heo, Youngsub Kim, Jungho Park, Kwanghyun Baek, Youngju Lee, Kyoungho Jeong, Dohyuk Ha
  • Publication number: 20240056520
    Abstract: In various embodiments, a module for a wireless communication includes: a radiator, a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed, and a second substrate including a power supply. The first substrate includes a plurality of first layers. The second substrate includes a plurality of second layers. The radiator is disposed on a radiation layer of the plurality of first layers of the first substrate. The plurality of resonators is disposed on a resonance layer of the plurality of first layers of the first substrate. At least part of the plurality of resonators in the resonance layer is disposed in an area in the radiation layer, different from an area in which the radiator is disposed.
    Type: Application
    Filed: May 8, 2023
    Publication date: February 15, 2024
    Inventors: Youngsub KIM, Jungho PARK, Kwanghyun BAEK, Jungyub LEE, Juneseok LEE, Dohyuk HA
  • Patent number: 11871516
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: January 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwanghyun Baek, Juneseok Lee, Dohyuk Ha, Youngju Lee, Jinsu Heo
  • Publication number: 20230387598
    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Inventors: Youngsub KIM, Sanghoon PARK, Jungho PARK, Kwanghyun BAEK, Youngju LEE, Jungyub LEE, Juneseok LEE, Dohyuk HA, Jinsu HEO
  • Publication number: 20230361451
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
    Type: Application
    Filed: June 12, 2023
    Publication date: November 9, 2023
    Inventors: Sanghoon PARK, Juneseok LEE, Dohyuk HA, Jungyub LEE, Jinsu HEO, Youngju LEE
  • Patent number: 11791546
    Abstract: Disclosed is an antenna device including an antenna substrate in which an array antenna comprising at least one radiation element is disposed, and a cover separated by a predetermined distance or more from the antenna substrate and comprising at least one repeating radiation element disposed to correspond to the at least one radiation element.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: October 17, 2023
    Inventors: Dohyuk Ha, Junsig Kum, Jungyub Lee, Youngju Lee
  • Publication number: 20230309827
    Abstract: Certain pressure sensor devices are much smaller than prior art devices, yet are at least as sensitive as the prior art devices. A capacitive pressure sensor can include a flexible substrate that permits bending of a pressure sensing region without significantly affecting operation thereof. The pressure sensor can include a flexible membrane in which an electrode is sandwiched between two layers of polymeric material. The sandwiched electrode can be extremely close to a reference electrode so as to provide for highly sensitive capacitance readings, yet the membrane can be restricted from contacting the reference electrode under high pressure condition.
    Type: Application
    Filed: October 19, 2022
    Publication date: October 5, 2023
    Applicants: The Jackson Laboratory, Purdue Research Foundation
    Inventors: Pedro P. Irazoqui, Dohyuk Ha, William J. Chappell, Simon W.M. John
  • Publication number: 20230299506
    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
    Type: Application
    Filed: March 30, 2023
    Publication date: September 21, 2023
    Inventors: Sanghoon PARK, Kwanghyun BAEK, Juneseok LEE, Dohyuk HA, Jungho PARK, Youngju LEE, Jungyub LEE, Jinsu HEO
  • Patent number: 11764459
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: September 19, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Juneseok Lee, Junsig Kum, Kwanghyun Baek, Dohyuk Ha, Jinsu Heo, Youngju Lee, Jungyub Lee