Patents by Inventor Dohyun AHN

Dohyun AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20230098815
    Abstract: A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.
    Type: Application
    Filed: August 2, 2022
    Publication date: March 30, 2023
    Inventors: Minki CHO, Jungsoo KIM, Dohyun AHN, Wonchul CHO, Taeyun KIM, Wonjun JEONG, Kwangsic CHOI, Chonguk HEO
  • Camera module
    Patent number: 11405540
    Abstract: A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: August 2, 2022
    Inventors: Gwan Yong Lee, Cheol Hwang, Dohyun Ahn
  • CAMERA MODULE
    Publication number: 20190349507
    Abstract: A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.
    Type: Application
    Filed: November 16, 2017
    Publication date: November 14, 2019
    Inventors: Gwan Yong LEE, Cheol HWANG, Dohyun AHN