Patents by Inventor DokOk Yu

DokOk Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with heatsink cap and method of manufacture thereof
    Patent number: 9142481
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: September 22, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Gwangjin Kim, JoungIn Yang, DokOk Yu, Hoon Jung, Jae Han Chung
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20130322023
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate.
    Type: Application
    Filed: June 5, 2012
    Publication date: December 5, 2013
    Inventors: Gwangjin Kim, JoungIn Yang, DokOk Yu, Hoon Jung, Jae Han Chung
  • Integrated circuit packaging system with film assistance mold and method of manufacture thereof
    Patent number: 8524538
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate, the integrated circuit having an inactive side and a non-horizontal side; mounting a mold chase having a buffer layer over the integrated circuit; forming an encapsulation between the substrate and the buffer; and removing the mold chase, leaving the encapsulation having a recess exposing a portion of the non-horizontal side.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: September 3, 2013
    Assignee: Stats Chippac Ltd.
    Inventors: JaeHyun Lee, Ki Youn Jang, DokOk Yu
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSISTANCE MOLD AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20130154121
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate, the integrated circuit having an inactive side and a non-horizontal side; mounting a mold chase having a buffer layer over the integrated circuit; forming an encapsulation between the substrate and the buffer; and removing the mold chase, leaving the encapsulation having a recess exposing a portion of the non-horizontal side.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 20, 2013
    Inventors: JaeHyun Lee, Ki Youn Jang, DokOk Yu