Abstract: A scouting system can include an autonomous ground vehicle having a perception sensor and a motion sensor to construct an occupancy grid referenced to a coordinate system of the autonomous ground vehicle. The autonomous ground vehicle is configured to use information from the occupancy grid to detect crop rows in a crop field. The autonomous ground vehicle is configured to identify and classify one or more non-crop plant in-lier objects arranged within the crop rows and generate an output signal received by an external vehicle to cause the external vehicle to perform a task when the one or more non-crop plant in-lier objects are identified within the crop rows.

Abstract: A scouting system can include an autonomous ground vehicle having a perception sensor and a motion sensor to construct an occupancy grid referenced to a coordinate system of the autonomous ground vehicle. The autonomous ground vehicle is configured to use information from the occupancy grid to detect crop rows in a crop field. The autonomous ground vehicle is configured to identify and classify one or more non-crop plant in-lier objects arranged within the crop rows and generate an output signal received by an external vehicle to cause the external vehicle to perform a task when the one or more non-crop plant in-lier objects are identified within the crop rows.

Abstract: An integrated circuit includes a composite transistor including at least a first transistor of a first technology type having a first group of intrinsic properties and a second transistor of a second technology type having a second group of the intrinsic properties, at least one of the intrinsic properties of the second group being substantially different than a corresponding intrinsic property of the first group, the second transistor having a first electrode coupled to a supply voltage, a second electrode coupled to a first electrode of the first transistor, and a control electrode coupled to a bias voltage conductor and also coupled to a control electrode and a second electrode of the first transistor. A source of bias current is coupled to the bias voltage conductor and is also coupled to the second electrode of the second transistor. A bias voltage across the composite transistor is produced on the bias voltage conductor to bias a cascode transistor of the first technology type.

Abstract: An IC package includes a package body of non-conductive material. A conductive heat-sink pad includes an interior pad portion located within an interior of the package body. An exterior pad portion is located external to the package body. The exterior pad portion includes at least two pad pieces that are spaced apart to define at least one channel that separates the at least two pad pieces, the at least two pad pieces being electrically connected with each other. The at least two pad pieces may be flush with an underside surface of the package body or one or more of the pad pieces may extend outwardly from the package body.

Abstract: A switched capacitor integrator system includes an input cascoded amplifier circuit; a summing junction; an integrating switched capacitor circuit connected to the output of the input cascoded amplifier circuit and to the summing junction; the integrating switched capacitor circuit including an input switched capacitor circuit responsive to an input and connected to the summing junction; and a correlated double sampling capacitor circuit including an offset capacitor interconnected between the summing junction and the input of the input cascoded amplifier circuit.

Abstract: An IC package includes a package body of non-conductive material. A conductive heat-sink pad includes an interior pad portion located within an interior of the package body. An exterior pad portion is located external to the package body. The exterior pad portion includes at least two pad pieces that are spaced apart to define at least one channel that separates the at least two pad pieces, the at least two pad pieces being electrically connected with each other. The at least two pad pieces may be flush with an underside surface of the package body or one or more of the pad pieces may extend outwardly from the package body.

Abstract: The present invention achieves technical advantages as a current monitoring circuit for DC-DC switching converters, including a track and latch comparator circuit (30) having a preamplifier (32) that is controlled independently of a latch circuit (34). Advantageously, the comparator is small and operates very fast and with improved sensitivity. For example, the preamplifier circuit is disabled when the latch stage is making its decision to avoid noise and input disturbances from affecting the latch stage. This selective disabling feature speeds up the signal processing of the comparator and allows it to work in parallel with other circuits. The latch stage can make its decision later, regardless of any further activity at the inputs of the comparator.

Abstract: A switched capacitor integrator system includes an input cascoded amplifier circuit; a summing junction; an integrating switched capacitor circuit connected to the output of the input cascoded amplifier circuit and to the summing junction; the integrating switched capacitor circuit including an input switched capacitor circuit responsive to an input and connected to the summing junction; and a correlated double sampling capacitor circuit including an offset capacitor interconnected between the summing junction and the input of the input cascoded amplifier circuit.

Abstract: The present application describes a frequency compensation scheme for a linear voltage regulator circuit, or its special case, a low-drop out voltage regulator (LDO). According to one embodiment, the frequency compensation scheme includes two circuits, an inner loop compensation circuit (240), and a circuit (245) at the output in parallel with one of the resistors of the output voltage divider (235). These two compensation elements (240, 245) are not interdependent and may be adjusted separately to provide more optimal frequency compensation. Advantages include smaller compensation circuit elements, die or board area savings, better phase margin over process technology variations and operating conditions, and ease of design adjustment.

Abstract: A temperature sensing read-out system for an integrated circuit includes a temperature sensor circuit for providing an analog signal representative of temperature and a high order sigma delta analog to digital converter responsive at its input to the analog signal representative of temperature to provide at its output a digital signal representative of temperature; the temperature sensing read-out system may be reconfigurable and include in addition to the temperature channel and auxiliary channel accompanied by a switching circuit for interconnecting in a temperature mode the temperature channel to the high order sigma delta analog to digital converter, and for interconnecting in one or more auxiliary modes the one or more auxiliary channels to the same sigma delta analog to digital converter.