Patents by Inventor Domenico Lo Presti

Domenico Lo Presti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid state photomultipliers array of enhanced fill factor and simplified packaging
    Patent number: 9466631
    Abstract: A multi-pixel photomultiplier optical sensor may include an array of photomultiplier dies. Each photomultiplier die may include a front side connection pad, SPAD cells, each SPAD cell including a front side electrode, a rear side electrode, and a resistor coupled in series to the front side electrode and coupled in common with other quenching resistors to the front side connection pad. The multi-pixel photomultiplier optical sensor may include a metallization layer in contact with the rear side electrode common to SPADs of the array of photomultiplier dies and electrically conductive pads. The electrically conductive bus may be coupled to an electrically conductive pin for distributing bias current to the array of photomultiplier dies.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: October 11, 2016
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: PieroGiorgio Fallica, MarioFrancesco Romeo, Domenico Lo Presti
  • SOLID STATE PHOTOMULTIPLIERS ARRAY OF ENHANCED FILL FACTOR AND SIMPLIFIED PACKAGING
    Publication number: 20150333095
    Abstract: A multi-pixel photomultiplier optical sensor may include an array of photomultiplier dies. Each photomultiplier die may include a front side connection pad, SPAD cells, each SPAD cell including a front side electrode, a rear side electrode, and a resistor coupled in series to the front side electrode and coupled in common with other quenching resistors to the front side connection pad. The multi-pixel photomultiplier optical sensor may include a metallization layer in contact with the rear side electrode common to SPADs of the array of photomultiplier dies and electrically conductive pads. The electrically conductive bus may be coupled to an electrically conductive pin for distributing bias current to the array of photomultiplier dies.
    Type: Application
    Filed: May 5, 2015
    Publication date: November 19, 2015
    Inventors: PieroGiorgio FALLICA, MarioFrancesco Romeo, Domenico Lo Presti