Abstract: A module includes discontinuities, such as openings or slots, between regions of a conductive shield that correspond to circuits on a substrate. The discontinuities are provided to perturb current flow between the regions to reduce coupling between the circuits. The circuits may be transmit (TX) circuits and receive (RX) circuits, including acoustic filters on a printed circuit board.

Abstract: The present disclosure relates to segmented shielding using wirebonds. In an exemplary aspect, a shield is formed from a series of wires (e.g., wirebonds) to create a wall and/or shielded compartment in an integrated circuit (IC) module. The wires can be located in any area within the IC module. The IC module may be overmolded with an insulating mold compound, and a top surface of the insulating mold can be ground or otherwise removed to expose ends of the wires to a shield layer which surrounds the insulating mold. Some examples may further laser ablate or otherwise form cavities around the ends of the wires to create stronger bonding between the wires of the shield and the shield layer.

Abstract: The present disclosure relates to segmented shielding using wirebonds. In an exemplary aspect, a shield is formed from a series of wires (e.g., wirebonds) to create a wall and/or shielded compartment in an integrated circuit (IC) module. The wires can be located in any area within the IC module. The IC module may be overmolded with an insulating mold compound, and a top surface of the insulating mold can be ground or otherwise removed to expose ends of the wires to a shield layer which surrounds the insulating mold. Some examples may further laser ablate or otherwise form cavities around the ends of the wires to create stronger bonding between the wires of the shield and the shield layer.