Patents by Inventor Dominic A. Herincx

Dominic A. Herincx has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230382098
    Abstract: The disclosure provides a method for fabricating a cantilever section in a structure, which includes providing a structure comprising a substrate, a compliant layer and a sacrificial layer therebetween; cutting part-way through the substrate to create an at least one linear partial cut; releasing the sacrificial layer from the structure; and breaking the substrate along the at least one linear partial cut to generate a cantilever section in a substrate.
    Type: Application
    Filed: May 31, 2022
    Publication date: November 30, 2023
    Applicant: Neuralink Corp.
    Inventors: Yu Niu Huang, Peter J. Gilgunn, Dominic A. Herincx, Zachary M. Tedoff
  • Publication number: 20230154809
    Abstract: An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending out of the enclosure. The implantable device includes a PCTFE first portion of an enclosure and a PCTFE second portion of the enclosure. The first and second portions are configured to mate with each other to form the enclosure. A plurality of insulated wires extend between the first and second portions of the enclosure. Each of the insulated wires are parallel to each other and separated by less than 150 micrometers (?m) from a neighboring wire. A thermal weld seam of PCTFE is disposed between the first portion of the enclosure and the second portion of the enclosure and conformally adheres around insulation of each wire such that the enclosure is sealed.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Applicant: Neuralink Corp.
    Inventors: John W.F. To, Ik Soo Kwon, Donjin Seo, Yu Niu ("Peter") Huang, Jiahao Guo, Robin E. Young, Joshua Scott Hess, Zachary M. Tedoff, Russell N. Ohnemus, Dominic A. Herincx