Patents by Inventor Dominic Anthony Messuri

Dominic Anthony Messuri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10516238
    Abstract: A method of forming a shielded electrical terminal configured to receive a corresponding shielded electrical terminal. The terminal includes an inner shield defining a shield cavity about a longitudinal axis. The shield cavity is configured to receive the corresponding shielded electrical terminal. The inner shield has a longitudinal inner seam substantially that is parallel to the longitudinal axis. The inner shield defines a plurality of resilient contact springs that protrude into the shield cavity. The contact springs are configured to contact the corresponding shielded electrical terminal. The terminal also includes an outer shield integrally formed with the inner shield and covering at least a portion of the inner shield. The terminal formed by this method is also presented.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: December 24, 2019
    Assignee: DELPHI TECHNOLOGIES, LLC
    Inventors: Joon Lee, Dominic Anthony Messuri, Christopher Adrian Margrave, Michael Jerry Demonica, John R. Morello
  • Patent number: 10211546
    Abstract: An electrical connection system configured to terminate electrical connectors and to transmit digital electrical signals having a data transfer rate of 5 Gigabits per second (Gb/s) or higher. The system includes a first parallel mirrored pair of terminals having a planar connection portion and a second pair of parallel mirrored terminals having a cantilever beam portion and a contact points configured to contact the first terminals. The cantilever beam portions are generally perpendicular to the planar connection portions. The terminals cooperate to provide consistent characteristic impedance. The connection system further includes an electromagnetic shield that longitudinally surrounds the terminals. The connection system is suited for terminating wire cables transmitting digital signals using data transfer protocols such as Universal Serial Bus (USB) 3.0 and High Definition Multimedia Interface (HDMI) 1.4.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: February 19, 2019
    Assignee: Aptiv Technologies Limited
    Inventors: Richard J. Boyer, Klara P. Carbone, Leslie L. Jones, Nicole L. Liptak, Dominic Anthony Messuri
  • Publication number: 20180358757
    Abstract: A method of forming a shielded electrical terminal configured to receive a corresponding shielded electrical terminal. The terminal includes an inner shield defining a shield cavity about a longitudinal axis. The shield cavity is configured to receive the corresponding shielded electrical terminal. The inner shield has a longitudinal inner seam substantially that is parallel to the longitudinal axis. The inner shield defines a plurality of resilient contact springs that protrude into the shield cavity. The contact springs are configured to contact the corresponding shielded electrical terminal. The terminal also includes an outer shield integrally formed with the inner shield and covering at least a portion of the inner shield. The terminal formed by this method is also presented.
    Type: Application
    Filed: June 5, 2018
    Publication date: December 13, 2018
    Inventors: Joon Lee, Dominic Anthony Messuri, Christopher Adrian Margrave, Michael Jerry Demonica, John R. Morello
  • Publication number: 20180062280
    Abstract: An electrical connection system configured to terminate electrical connectors and to transmit digital electrical signals having a data transfer rate of 5 Gigabits per second (Gb/s) or higher. The system includes a first parallel mirrored pair of terminals having a planar connection portion and a second pair of parallel mirrored terminals having a cantilever beam portion and a contact points configured to contact the first terminals. The cantilever beam portions are generally perpendicular to the planar connection portions. The terminals cooperate to provide consistent characteristic impedance. The connection system further includes an electromagnetic shield that longitudinally surrounds the terminals. The connection system is suited for terminating wire cables transmitting digital signals using data transfer protocols such as Universal Serial Bus (USB) 3.0 and High Definition Multimedia Interface (HDMI) 1.4.
    Type: Application
    Filed: November 6, 2017
    Publication date: March 1, 2018
    Inventors: Richard J. Boyer, Klara P. Carbone, Leslie L. Jones, Nicole L. Liptak, Dominic Anthony Messuri
  • Patent number: 8477513
    Abstract: A connector includes an electromagnetic shield formed of conductive material with at least two depending, conductive, reinforcement sidewalls that each have a plurality of conductive depending sidewall legs distributed about a periphery of the shield and extending upwardly. The shield includes at least one conductive ground tab extending from an edge such that the shield provides a ground path directly from a circuit board to a connector housing. The shield defines at least one opening for receiving an alignment post and at least one additional rectangular opening to permit access to an electrical terminal positioned below the sheet. The rectangular opening may be aligned with terminals positioned within connector housing.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: July 2, 2013
    Assignee: Delphi Technologies, Inc.
    Inventors: Peter M. Politsky, Dominic Anthony Messuri, Michael W. Allender
  • Publication number: 20120244751
    Abstract: An electromagnetic shield for an electrical connector comprises a sheet formed of conductive material and has a top side with at least two depending, conductive, reinforcement sidewalls that each have a plurality of conductive depending sidewall legs distributed about a periphery of the sheet and extending upwardly. The shield includes at least one conductive ground tab extending from an edge such that the shield provides a ground path directly from a circuit board to a connector housing. The shield defines at least one opening for receiving an alignment post and at least one additional opening to permit access to an electrical terminal positioned below the sheet. The openings may be rectangular in shape and aligned with terminals positioned within connector housing.
    Type: Application
    Filed: March 25, 2011
    Publication date: September 27, 2012
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: PETER M. POLITSKY, DOMINIC ANTHONY MESSURI, MICHAEL W. ALLENDER
  • Patent number: 7204730
    Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: April 17, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Daniel S Eichorn, Michael W Allender, Dominic Anthony Messuri, Christopher Alan Brandon
  • Patent number: 7025640
    Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: April 11, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Daniel S Eichorn, Michael W Allender, Dominic Anthony Messuri, Christopher Alan Brandon
  • Publication number: 20040092174
    Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.
    Type: Application
    Filed: September 19, 2003
    Publication date: May 13, 2004
    Inventors: Daniel S. Eichorn, Michael W. Allender, Dominic Anthony Messuri, Christopher Alan Brandon
  • Patent number: 6512430
    Abstract: A passive low pass, &pgr;-type filter of a surface mounted device configuration has two stack capacitors disposed radially inwardly of a coil, otherwise known as an inductor. Each capacitor has a number of ground plates successively stacked between a number of signal plates. The ground plates electrically engage a front and rear ground band which circles the external surface of a non-conductive encapsulant of the filter. A forward and rearward conductive member or sheet engages each end of the encapsulant. One end of the coil is engaged to the front sheet and the opposite end is engaged to the rear sheet. The signal plates of the forward capacitor are engaged to the front sheet and the signal plates of the rearward capacitor are engaged electrically to the rear sheet.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: January 28, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: William Thomas Phillips, Jr., Dominic Anthony Messuri, Joseph V. Mantese
  • Patent number: 6413119
    Abstract: A filtered electrical connector has a die cast aluminum housing that is mounted to a printed circuit board for attaching wiring harnesses to the printed circuit board for transmitting electrical signals to and from the circuitry of the printed circuit board. The die cast housing has six compartments that have a socket on the bottom of the housing for receiving the end connector of one of the wiring harnesses. A plastic retainer that holds several contact pins is secured in the lower portion of each compartment. A plated plastic filter insert having an anistropic substrate and surface mounted capacitors is encapsulated in an enlarged upper portion of each compartment. The contact pins extend through the filter insert and a ferrite block that is embedded above the filter insert. The ferrite block is covered by an insulation sheet to avoid short circuits in the printed circuit board and protect against bent pins.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: July 2, 2002
    Assignee: Delphi Technologies, Inc.
    Inventors: Ronald E. Gabrisko, Jr., Brian Matthew Donato, Burlyn Dean Nash, Dominic Anthony Messuri, Randy Lynn Fink
  • Patent number: 6346865
    Abstract: An EMI filter (10) that makes use of a ferroelectric-ferromagnetic composite, member, or slab (12) in connection with capacitive and inductive elements. The geometrical structure of the filter (10) is such that the mutually orthogonal electric fields and magnetic fields generated by the capacitive and inductive elements penetrate the volume of the composite (12). In some designs, capacitive plates (14, 18, 32, 34) are split to avoid setting up eddy currents in the plates (14, 18, 32, 34) which oppose the penetration of magnetic flux through the composite (12). Various structural designs can be provided to define the capacitive elements and the inductive elements in different configurations relative to the composite to satisfy the desirable requirements.
    Type: Grant
    Filed: April 29, 1999
    Date of Patent: February 12, 2002
    Assignee: Delphi Technologies, Inc.
    Inventors: Clyde Maynord Callewaert, Edward Patrick Manning, Joseph Vito Mantese, Dominic Anthony Messuri, Adolph Louis Micheli, Steven A Musick, William Thomas Phillips, Jr., Norman William Schubring, Dennis Forest Dungan
  • Patent number: 5647768
    Abstract: This invention includes a filtered header electrical connector including a connector body having a reduced mass underlying a surface-mounted chip capacitor. The reduced connector body mass underneath the chip capacitor is achieved by side cores or recesses formed in the wall of the connector so that the chip capacitor sits on an outwardly extending lip.
    Type: Grant
    Filed: March 11, 1996
    Date of Patent: July 15, 1997
    Assignee: General Motors Corporation
    Inventors: Dominic Anthony Messuri, Burlyn Dean Nash